Patents by Inventor Pascal Coirault

Pascal Coirault has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGING FOR CLIP-ASSEMBLED ELECTRONIC COMPONENTS
    Publication number: 20130017649
    Abstract: A system for assembling electronic chips in a package, including a first lead frame defining chip reception areas; and a second lead frame defining chip coverage areas, the frames including, at least at their periphery, pairs of mutually-cooperating elements for maintaining the frames together.
    Type: Application
    Filed: October 29, 2010
    Publication date: January 17, 2013
    Applicant: STMicroelectronics (Tours) SAS
    Inventors: Dominique Touzet, Pascal Coirault