Patents by Inventor Pascal Couderc

Pascal Couderc has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8359740
    Abstract: A process for the wafer-scale fabrication of CMS electronic modules starts from a wafer with metallized outputs, comprising electronic components molded in resin and, on one side, the external outputs of the electronic components on which a nonoxidizable metal or alloy is deposited, and of a printed circuit provided with oxidizable metal or alloy contact pads. In the process, the wafer is cut in predetermined patterns for obtaining reconfigured molded components that include at least one electronic component; the reconfigured components are assembled on the printed circuit, the metallized external outputs of the reconfigured components being placed opposite the metallized contact pads of the printed circuit; and these external outputs are connected solderlessly to the metallized contact pads of the printed circuit by means of a material based on an electrically conductive adhesive or ink.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: January 29, 2013
    Assignee: 3D Plus
    Inventors: Christian Val, Pascal Couderc, Alexandre Val
  • Publication number: 20110247210
    Abstract: A process for the wafer-scale fabrication of CMS electronic modules starts from a wafer with metallized outputs, comprising electronic components molded in resin and, on one side, the external outputs of the electronic components on which a nonoxidizable metal or alloy is deposited, and of a printed circuit provided with oxidizable metal or alloy contact pads. In the process, the wafer is cut in predetermined patterns for obtaining reconfigured molded components that include at least one electronic component; the reconfigured components are assembled on the printed circuit, the metallized external outputs of the reconfigured components being placed opposite the metallized contact pads of the printed circuit; and these external outputs are connected solderlessly to the metallized contact pads of the printed circuit by means of a material based on an electrically conductive adhesive or ink.
    Type: Application
    Filed: December 18, 2009
    Publication date: October 13, 2011
    Applicant: 3D PLUS
    Inventors: Christian Val, Pascal Couderc, Alexandre Val
  • Patent number: 4860100
    Abstract: A system which provides synchronization with frame synchronization words of a partially digital signal, such as that of the D2MAC television standard. It is provided that three modes of operation are established sequentially. In a first mode, the values necessary to control the gain and the d.c. level of the television signal are obtained by means of a peak detector (18). Similarly, in a second mode, the peak detector is enabled only during the digital signal periods of the D2MAC signal. Finally, in the third mode, the setting values are obtained by arrangements (13, 8) which depend on the clamp plateau measurement of each line and of line 624.
    Type: Grant
    Filed: February 8, 1988
    Date of Patent: August 22, 1989
    Assignee: U.S. Philips Corporation
    Inventors: Issa Rakhodai, Serge G. Lefebvre, Pascal Couderc