Patents by Inventor Pascal Etourneau

Pascal Etourneau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for surface mounting of a microwave package on a printed circuit and package and printed circuit for implementing said method
    Patent number: 6560121
    Abstract: The surface mounting of a backset microwave package on a printed circuit. After the package has been accurately positioned against the printed circuit the connections are produced by soldering the conducting elements in direct contact. A chip is enclosed in a sort of cage constituting a screen which replaces a conventional cover, the cage is formed by layouts borne respectively by the package and the printed circuit and is linked together by metal links. The surface mounting is particularly applicable to packages operating in millimetric microwaves.
    Type: Grant
    Filed: May 26, 2000
    Date of Patent: May 6, 2003
    Assignee: Thomson-CSF
    Inventors: Jean-Yves Daden, Muriel Gohn-Devineau, Gérard Cachier, Pascal Etourneau, Vincent Jahier, Alain Grancher, Ludovic Michel