Patents by Inventor Pascal Letourneau

Pascal Letourneau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Abrasive composition for the integrated circuit electronics industry
    Patent number: 7252695
    Abstract: Abrasive composition for the integrated circuits electronics industry comprising an aqueous acid suspension of individualized colloidal silica particles not linked to each other by siloxane bonds and an abrasive surfactant, this abrasive being for mechanical chemical polishing in the integrated circuits industry, comprising a fabric impregnated by such a composition, and a process for mechanical chemical polishing.
    Type: Grant
    Filed: November 8, 2006
    Date of Patent: August 7, 2007
    Assignee: AZ Electronic Materials USA Corp.
    Inventors: Eric Jacquinot, Pascal Letourneau, Maurice Rivoire
  • New abrasive composition for the integrated circuit electronics industry
    Publication number: 20070051918
    Abstract: Abrasive composition for the integrated circuits electronics industry comprising an aqueous acid suspension of individualized colloidal silica particles not linked to each other by siloxane bonds and an abrasive surfactant, this abrasive being for mechanical chemical polishing in the integrated circuits industry, comprising a fabric impregnated by such a composition, and a process for mechanical chemical polishing.
    Type: Application
    Filed: November 8, 2006
    Publication date: March 8, 2007
    Applicant: AZ Electronic Materials USA Corp.
    Inventors: Eric Jacquinot, Pascal Letourneau, Maurice Rivoire
  • Abrasive composition for the integrated circuits electronics industry
    Patent number: 7144814
    Abstract: Abrasive composition for the integrated circuits electronics industry comprising an aqueous acid suspension of individualized colloidal silica particles not linked to each other by siloxane bonds and an abrasive surfactant, this abrasive being for mechanical chemical polishing in the integrated circuits industry, comprising a fabric impregnated by such a composition, and a process for mechanical chemical polishing.
    Type: Grant
    Filed: October 27, 1999
    Date of Patent: December 5, 2006
    Assignee: AZ Electronic Materials USA Corp.
    Inventors: Eric Jacquinot, Pascal Letourneau, Maurice Rivoire
  • ABRASIVE COMPOSITION FOR THE INTEGRATED CIRCUITS ELECTRONICS INDUSTRY
    Publication number: 20020142600
    Abstract: Abrasive composition for the integrated circuits electronics industry comprising an aqueous acid suspension of individualized colloidal silica particles not linked to each other by siloxane bonds and an abrasive surfactant, this abrasive being for mechanical chemical polishing in the integrated circuits industry, comprising a fabric impregnated by such a composition, and a process for mechanical chemical polishing.
    Type: Application
    Filed: October 27, 1999
    Publication date: October 3, 2002
    Inventors: ERIC JACQUINOT, PASCAL LETOURNEAU, MAURICE RIVOIRE
  • Process for mechanical chemical polishing of layer of aluminium or aluminium alloy conducting material
    Patent number: 6386950
    Abstract: Process for mechanical chemical polishing of a layer of an aluminium or aluminium alloy conducting material used in the microelectronics semi-conductors industry in which said aluminium or aluminium alloy layer is abraded using an abrasive composition which comprises an alkaline aqueous suspension of individualized colloidal silica particles not linked to each other by siloxane bonds, a tetraalkylammonium hydroxide and an oxidizing agent.
    Type: Grant
    Filed: February 17, 2000
    Date of Patent: May 14, 2002
    Assignee: Clariant (France) S.A.
    Inventors: Eric Jacquinot, Pascal Letourneau, Maurice Rivoire
  • Composition for mechanical chemical polishing of layers in an insulating material based on a polymer with a low dielectric constant
    Patent number: 6362108
    Abstract: A composition for mechanical chemical polishing of a layer in an insulating material based on a polymer with a low dielectric constant, comprising an acid aqueous suspension of cationized colloidal silica containing individualized colloidal silica particles not linked to each other by siloxane bonds and water as the suspension medium, process for mechanical chemical polishing of a layer of insulating material based on a polymer with a low dielectric constant and abrasive for the mechanical chemical polishing of a layer of insulating material based on a polymer with a low dielectric constant.
    Type: Grant
    Filed: April 20, 2000
    Date of Patent: March 26, 2002
    Assignee: Clariant (France) S.A.
    Inventors: Eric Jacquinot, Pascal Letourneau, Maurice Rivoire
  • Process for mechanical chemical polishing of a layer in a copper-based material
    Patent number: 6302765
    Abstract: Process for mechanical chemical polishing of a layer in a copper-based material using a polishing composition, characterized in that said polishing composition comprises an aqueous suspension of individualized colloidal silica particles not linked to each other by siloxane bonds, the average diameter of which is comprised between 10 and 100 nm, the pH of the aqueous suspension being comprised between 1 and 5.
    Type: Grant
    Filed: August 2, 1999
    Date of Patent: October 16, 2001
    Assignee: Clariant France S.A.
    Inventors: Eric Jacquinot, Pascal Letourneau, Maurice Rivoire