Abstract: For the purposes of positioning a component part, provision is made in an optical system for a stray magnetic field to be detected via a sensor device and for a correction signal for compensating the effect of the stray magnetic field on the positioning of the component part to be ascertained.

Abstract: For the purposes of positioning a component part, provision is made in an optical system for a stray magnetic field to be detected via a sensor device and for a correction signal for compensating the effect of the stray magnetic field on the positioning of the component part to be ascertained.

Abstract: The disclosure relates to a bearing assembly for a lithography system, having an optical element, a base, and a bearing device that moveably supports the optical element relative to the base. The bearing device has at least one torsion decoupling element that reduces a transmission of torsional moments between the optical element and the base. The torsion decoupling element has at least two leaf springs which have respective opposing narrow sides and which bring about torsional moments about an axis perpendicular to the narrow sides. The at least two leaf springs are also positioned at an angle to one another and are coupled to one another in such a way that a force flow through the torsion decoupling element simultaneously flows through the at least two leaf springs.

Abstract: The disclosure relates to a bearing assembly for a lithography system, having an optical element, a base, and a bearing device that moveably supports the optical element relative to the base. The bearing device has at least one torsion decoupling element that reduces a transmission of torsional moments between the optical element and the base. The torsion decoupling element has at least two leaf springs which have respective opposing narrow sides and which bring about torsional moments about an axis perpendicular to the narrow sides. The at least two leaf springs are also positioned at an angle to one another and are coupled to one another in such a way that a force flow through the torsion decoupling element simultaneously flows through the at least two leaf springs.

Abstract: A semiconductor lithography projection exposure apparatus includes a projection lens which includes a manipulator. The manipulator includes an optical element; a base frame; a sensor frame arranged on the base frame; and a sensor arranged on the sensor frame. The manipulator is configured to correct wavefront aberrations of used optical radiation that pass through the optical element during the operation of the projection lens. The manipulator is arranged directly after an object plane of the apparatus along a path of the used optical radiation. The sensor is configured to measure a deformation or a deflection of the optical element. A coefficient of thermal expansion of the sensor frame is within 16 ppm/K of a coefficient of thermal expansion of the base frame.

Abstract: A projection exposure apparatus for semiconductor lithography includes a deformable optical element for the correction of wavefront aberrations. Actuating units for the deformation of the optical element are in mechanical contact with the optical element by way of contact regions. The contact regions are arranged in a regular or irregular arrangement outside an optically active region of the optical element. There are contact regions lying closest to the optically active region and remote contact regions.

Abstract: A projection exposure apparatus for semiconductor lithography includes a deformable optical element for the correction of wavefront aberrations. Actuating units for the deformation of the optical element are in mechanical contact with the optical element by way of contact regions. The contact regions are arranged in a regular or irregular arrangement outside an optically active region of the optical element. There are contact regions lying closest to the optically active region and remote contact regions.

Abstract: A semiconductor lithography projection exposure apparatus includes a projection lens which includes a manipulator. The manipulator includes an optical element; a base frame; a sensor frame arranged on the base frame; and a sensor arranged on the sensor frame. The manipulator is configured to correct wavefront aberrations of used optical radiation that pass through the optical element during the operation of the projection lens. The manipulator is arranged directly after an object plane of the apparatus along a path of the used optical radiation. The sensor is configured to measure a deformation or a deflection of the optical element. A coefficient of thermal expansion of the sensor frame is within 16 ppm/K of a coefficient of thermal expansion of the base frame.