Patents by Inventor Pascal R. Ackermann-Karam

Pascal R. Ackermann-Karam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ROOM TEMPERATURE GLASS-TO-GLASS, GLASS-TO-PLASTIC AND GLASS-TO-GLASS CERAMIC/SEMICONDUCTOR BONDING
    Publication number: 20230124770
    Abstract: A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.
    Type: Application
    Filed: December 21, 2022
    Publication date: April 20, 2023
    Inventors: Pascal R. Ackermann-Karam, Mark Finkle, Daniella M. Harvey, Raymond Miller Karam, Georges Roussos
  • Room temperature glass-to-glass, glass-to-plastic and glass-to-ceramic/semiconductor bonding
    Patent number: 11571860
    Abstract: A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: February 7, 2023
    Assignee: CORNING INCORPORATED
    Inventors: Raymond Miller Karam, Georges Roussos, Mark Finkle, Danielle M. Harvey, Pascal R. Ackermann-Karam
  • ROOM TEMPERATURE GLASS-TO-GLASS, GLASS-TO-PLASTIC AND GLASS-TO-CERAMIC/SEMICONDUCTOR BONDING
    Publication number: 20190232569
    Abstract: A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.
    Type: Application
    Filed: April 8, 2019
    Publication date: August 1, 2019
    Inventors: Raymond Miller Karam, Georges Roussos, Mark Finkle, Daniella M. Harvey, Pascal R. Ackermann-Karam
  • Room temperature glass-to-glass, glass-to-plastic and glass-to-ceramic/semiconductor bonding
    Patent number: 10293551
    Abstract: A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: May 21, 2019
    Assignee: PICOSYS INCORPORATED
    Inventors: Raymond Miller Karam, Georges Roussos, Mark Finkle, Daniella M. Harvey, Pascal R. Ackermann-Karam
  • ROOM TEMPERATURE GLASS-TO-GLASS, GLASS-TO-PLASTIC AND GLASS-TO-CERAMIC/SEMICONDUCTOR BONDING
    Publication number: 20170008223
    Abstract: A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.
    Type: Application
    Filed: September 23, 2016
    Publication date: January 12, 2017
    Inventors: Raymond Miller Karam, Georges Roussos, Mark Finkle, Daniella M. Harvey, Pascal R. Ackermann-Karam
  • Room temperature glass-to-glass, glass-to-plastic and glass-to-ceramic/semiconductor bonding
    Patent number: 9492990
    Abstract: A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.
    Type: Grant
    Filed: November 8, 2011
    Date of Patent: November 15, 2016
    Assignee: PICOSYS INCORPORATED
    Inventors: Ramond Miller Karam, Georges Roussos, Mark Finkle, Daniella M. Harvey, Pascal R. Ackermann-Karam
  • ROOM TEMPERATURE GLASS-TO-GLASS, GLASS-TO-PLASTIC AND GLASS-TO-CERAMIC/SEMICONDUCTOR BONDING
    Publication number: 20130112650
    Abstract: A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.
    Type: Application
    Filed: November 8, 2011
    Publication date: May 9, 2013
    Applicant: INVENIOS
    Inventors: Raymond Miller Karam, Georges Roussos, Mark Finkle, Daniella M. Harvey, Pascal R. Ackermann-Karam