Abstract: An integration system and method for the manufacture of radio frequency transmission front-end modules with radio frequency integrated circuit(s) and self-biased magnetic component(s) integrated on a “Wafer Level Packaging”-type technology. This integration makes it possible to design efficient, compact and low-cost front-end modules.

Abstract: An RF circuit for wireless devices comprises a single differential power amplifier and an impedance balancing circuit for each frequency band. The impedance balancing circuit serves both to provide an appropriate impedance at the output of the amplifier as the operating mode of the device changes, and also transforms the differential output of the amplifier to a single-ended output. The impedance balancing circuit optionally comprises a BALUN circuit and a variable capacitor that is varied as the operating mode changes in order to vary the impedance at the output of the amplifier.

Abstract: An RF circuit for wireless devices comprises a single differential power amplifier and an impedance balancing circuit for each frequency band. The impedance balancing circuit serves both to provide an appropriate impedance at the output of the amplifier as the operating mode of the device changes, and also transforms the differential output of the amplifier to a single-ended output. The impedance balancing circuit optionally comprises a BALUN circuit and a variable capacitor that is varied as the operating mode changes in order to vary the impedance at the output of the amplifier.

Abstract: A palm plate designed to be attached to the hand of a user. The palm plate has a surface of a fitted form upon which the hand rests. The plate is equipped with an attached mechanism having a sensor. The sensor can transmit a signal to a microprocessor capable of calculating a certain number of parameters which are displayed on a read-out screen. The microprocessor, its electronic system and the screen are carried by the plate.