Abstract: A process for treating water is provided where the water is mixed with an inorganic reagent powder such as powder activated carbon. Organics and micropollutants are absorbed by the reagent powder. After the reagent powder has been mixed with the water, the water is directed to a setting tank and sludge from the water settles to produce a clarified effluent. Forming a part of the sludge is the reagent powder previously added. Sludge is collected and directed to a separator that separates the reagent powder from the sludge. Separated reagent powder is recycled and mixed with the water being treated.

Abstract: A process for treating water is provided where the water is mixed with an inorganic reagent powder such as powder activated carbon. Organics and micropollutants are absorbed by the reagent powder. After the reagent powder has been mixed with the water, the water is directed to a setting tank and sludge from the water settles to produce a clarified effluent. Forming a part of the sludge is the reagent powder previously added. Sludge is collected and directed to a separator that separates the reagent powder from the sludge. Separated reagent powder is recycled and mixed with the water being treated.

Abstract: Disclosed is a method for the mounting, on an flexible substrate, of miniature electronic components of the beam lead type. Said method consists, after a first connection lead of a component has been soldered to the substrate, in arching each of the other connection leads of the component considered during their soldering by pressing the connection lead considered on a metallized zone of the substrate by means of a tip of a soldering tool while, at the same time, making a approaching movement towards the body of the component considered with this tip before carrying out the soldering operation itself. Through this mounting method, the beam lead electronic components are no longer placed flat against the substrate with their connection leads in an extended position but are arched on these leads. This gives them a freedom of play that enables them to absorb mechanical stresses by adopting positions of greater flatness or lesser flatness on the substrate.

Abstract: A symmetrical strip line type microwave circuit, the input-output connection zones of which are made in the following way:a groove is made in that of the insulating substrates which does not bear the central conductor of the symmetrical strip line circuit, along the contour of the desired connection zone;the two substrates are bonded together;the exterior of the structure is protected by electrolytic deposition of a tin-lead alloy;a counter-groove is made in the first substrate along the contour of the connection zone, and that portion of the substrate located inside the zone is eliminated.