Abstract: A semiconductor package, comprises an encapsulant which contains a semiconductor substrate, the package lower side being mountable on a surface. The semiconductor substrate backside is in close proximity of the semiconductor package lower side for improved thermal conductivity to the surface. The active side of the semiconductor substrate, facing the upper side of the semiconductor package, has a plurality of die contacts. A plurality of electrically conductive interconnects are connected to the die contacts and extend to the lower side of the semiconductor package for connecting the die contacts to the surface.

Abstract: A radio frequency device and mobile terminal having this device, includes a power amplifier (PA) for radio frequency signals (IRF, ORF) and a stabilizer (STB) for controlling power variations of the radio frequency output signal (ORF) as a function of variations of a reference voltage (VCON). The stabilizer is equal to a nominal resistance (RN) having a predetermined value as a function of an isopower curve (H, DH) of the power amplifier and generates for the power amplifier a supply voltage (VPA) in dependence on the reference voltage (VCON) and the nominal resistance (RN), so that the power consumption (PPA) and output power (POUT) are independent of the real internal resistance (RPA) of the power amplifier.