Patents by Inventor Pasi Juhani Laukka

Pasi Juhani Laukka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor bump-bonded X-ray imaging device
    Patent number: 9772410
    Abstract: A high pixel density intraoral x-ray imaging sensor includes a direct conversion, fully depleted silicon detector bump bonded to a readout CMOS substrate by cu-pillar bump bonds.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: September 26, 2017
    Assignee: OY AJAT LTD.
    Inventors: Konstantinos Spartiotis, Henri Tapio Nykanen, Limin Lin, Tuomas Heikki Elmeri Lahtinen, Pasi Juhani Laukka
  • SEMICONDUCTOR BUMP-BONDED X-RAY IMAGING DEVICE
    Publication number: 20160181306
    Abstract: A high pixel density intraoral x-ray imaging sensor includes a direct conversion, fully depleted silicon detector bump bonded to a readout CMOS substrate by cu-pillar bump bonds.
    Type: Application
    Filed: February 26, 2016
    Publication date: June 23, 2016
    Inventors: Konstantinos SPARTIOTIS, Henri Tapio NYKANEN, Limin LIN, Tuomas Heikki Elmeri LAHTINEN, Pasi Juhani LAUKKA
  • Semiconductor bump-bonded X-ray imaging device
    Patent number: 9329284
    Abstract: A high pixel density intraoral x-ray imaging sensor includes a direct conversion, fully depleted silicon detector bump bonded to a readout CMOS substrate by cu-pillar bump bonds.
    Type: Grant
    Filed: March 24, 2015
    Date of Patent: May 3, 2016
    Assignee: OY AJAT LTD.
    Inventors: Konstantinos Spartiotis, Henri Tapio Nykanen, Limin Lin, Tuomas Heikki Elmeri Lahtinen, Pasi Juhani Laukka
  • SEMICONDUCTOR BUMP-BONDED X-RAY IMAGING DEVICE
    Publication number: 20150276945
    Abstract: A high pixel density intraoral x-ray imaging sensor includes a direct conversion, fully depleted silicon detector bump bonded to a readout CMOS substrate by capillary bump bonds.
    Type: Application
    Filed: March 25, 2014
    Publication date: October 1, 2015
    Inventors: Konstantinos Spartiotis, Henri Tapio Nykanen, Limin Lin, Tuomas Heikki Elmeri Lahtinen, Pasi Juhani Laukka
  • SEMICONDUCTOR BUMP-BONDED X-RAY IMAGING DEVICE
    Publication number: 20150279890
    Abstract: A high pixel density intraoral x-ray imaging sensor includes a direct conversion, fully depleted silicon detector bump bonded to a readout CMOS substrate by cu-pillar bump bonds.
    Type: Application
    Filed: March 24, 2015
    Publication date: October 1, 2015
    Inventors: Konstantinos SPARTIOTIS, Henri Tapio NYKANEN, Limin LIN, Tuomas Heikki Elmeri LAHTINEN, Pasi Juhani LAUKKA