Patents by Inventor Pasing Zhiming Li

Pasing Zhiming Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9359478
    Abstract: The present invention provides a curable composition, comprising: (A) at least one polycarbosilane A represented by the following formula (1): [R1R2R3SiX1/2]M[R4R5SiX2/2]D[R6SiX3/2]T[SiX4/2]Q??(1), (B) at least one organopolysiloxane B represented by the following formula (2): [R7R8R9SiO1/2]M?[R10R11SiO2/2]D?[R12SiO3/2]T?[SiO4/2]Q?,??(2), and (C) at least a catalyst, as well as a cured product obtainable by heating such composition, and the use of the composition as semiconductor encapsulating material and/or electronic elements packaging material.
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: June 7, 2016
    Assignee: Henkel AG & Co. KGaA
    Inventors: Thomas Xing, Liwei Zhang, Pasing Zhiming Li, Yong Zhang, Juan Du
  • Publication number: 20150148510
    Abstract: The present invention provides a curable composition, comprising: (A) at least one polycarbosilane A represented by the following formula (1): [R1R2R3SiX1/2]M[R4R5SiX2/2]D[R6SiX3/2]T[SiX4/2]Q??(1) (B) at least one organopolysiloxane B represented by the following formula (2): [R7R8R9SiO1/2]M?[R10R11SiO2/2]D?[R12SiO3/2]T?[SiO4/2]Q?,??(2), and (C) at least a catalyst, as well as a cured product obtainable by heating such composition, and the use of the composition as semiconductor encapsulating material and/or electronic elements packaging material.
    Type: Application
    Filed: January 30, 2015
    Publication date: May 28, 2015
    Inventors: Thomas Xing, Liwei Zhang, Pasing Zhiming Li, Yong Zhang, Juan Du