Patents by Inventor PAT CHEN

PAT CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mixed mode slot antennas
    Patent number: 10530061
    Abstract: Example implementations relate to mixed mode slot antennas. Mixed mode slot antennas may be implemented in a display housing of a communication device. A mixed mode slot antenna unit may include a first PCB attached to a first metal layer to form a first mode antenna, where the first metal layer includes a first slot, and the first metal layer is a metal back cover of the display housing of the communication device. The mixed mode slot antenna unit may also include a second PCB coupled to the first PCB to form a second mode antenna, where the second metal layer includes a second slot, and where the second metal layer is a metal front cover of the display housing; and a non-conductive layer disposed between the first PCB and the second PCB to provide insulation between the first PCB and the second PCB.
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: January 7, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David Chi, Pat Chen
  • MIXED MODE SLOT ANTENNAS
    Publication number: 20180219296
    Abstract: Example implementations relate to mixed mode slot antennas. Mixed mode slot antennas may be implemented in a display housing of a communication device. A mixed mode slot antenna unit may include a first PCB attached to a first metal layer to form a first mode antenna, where the first metal layer includes a first slot, and the first metal layer is a metal back cover of the display housing of the communication device. The mixed mode slot antenna unit may also include a second PCB coupled to the first PCB to form a second mode antenna, where the second metal layer includes a second slot, and where the second metal layer is a metal front cover of the display housing; and a non-conductive layer disposed between the first PCB and the second PCB to provide insulation between the first PCB and the second PCB.
    Type: Application
    Filed: August 5, 2015
    Publication date: August 2, 2018
    Inventors: DAVID CHI, PAT CHEN