Abstract: A leadless semiconductor package includes a plurality of internal gull wing leads forming a concave region and an IC die disposed in the concave region and having a plurality of conductive bumps at a first surface connected to corresponding proximal sections of the internal gull wing leads. Distal ends of the internal gull wing leads form surface mount pads at a mounting surface of the leadless semiconductor package for mounting the package to a circuit board. Packaging encapsulant extends between the mounting surface and an opposing surface of the package and encapsulates the first surface of the IC die and the proximal ends of the internal gull wing lead structures. In some implementations, the mounting surface further includes a second surface of the IC die opposite the first surface and thus a thermally conductive material may be disposed between the second surface of the IC die and the circuit board.

Abstract: A leadless semiconductor package includes a conductive base having a plurality of apertures formed around a perimeter of the conductive base and extending from a first surface to an opposing second surface of the conductive base. The semiconductor package further includes an IC die having a third surface facing the first surface of the conductive base and having a plurality of conductive pillars disposed thereon. Each conductive pillar extends from the third surface to the first surface via a corresponding aperture. A dielectric fill material is disposed in the apertures and insulates the conductive pillars from the conductive material of the conductive base. An opening of an aperture at the second surface, the bottom end of the conductive pillar disposed therein, and the dielectric fill material at the opening of the aperture at the second surface together form a surface mount pad for mounting the semiconductor package to a corresponding pad of a circuit board.

Abstract: A leadless semiconductor package includes a conductive base having a plurality of apertures formed around a perimeter of the conductive base and extending from a first surface to an opposing second surface of the conductive base. The semiconductor package further includes an IC die having a third surface facing the first surface of the conductive base and having a plurality of conductive pillars disposed thereon. Each conductive pillar extends from the third surface to the first surface via a corresponding aperture. A dielectric fill material is disposed in the apertures and insulates the conductive pillars from the conductive material of the conductive base. An opening of an aperture at the second surface, the bottom end of the conductive pillar disposed therein, and the dielectric fill material at the opening of the aperture at the second surface together form a surface mount pad for mounting the semiconductor package to a corresponding pad of a circuit board.

Abstract: A leadless semiconductor package includes a conductive base having a plurality of apertures formed around a perimeter of the conductive base and extending from a first surface to an opposing second surface of the conductive base. The semiconductor package further includes an IC die having a third surface facing the first surface of the conductive base and having a plurality of conductive pillars disposed thereon. Each conductive pillar extends from the third surface to the first surface via a corresponding aperture. A dielectric fill material is disposed in the apertures and insulates the conductive pillars from the conductive material of the conductive base. An opening of an aperture at the second surface, the bottom end of the conductive pillar disposed therein, and the dielectric fill material at the opening of the aperture at the second surface together form a surface mount pad for mounting the semiconductor package to a corresponding pad of a circuit board.

Abstract: A leadless semiconductor package includes a plurality of internal gull wing leads forming a concave region and an IC die disposed in the concave region and having a plurality of conductive bumps at a first surface connected to corresponding proximal sections of the internal gull wing leads. Distal ends of the internal gull wing leads form surface mount pads at a mounting surface of the leadless semiconductor package for mounting the package to a circuit board. Packaging encapsulant extends between the mounting surface and an opposing surface of the package and encapsulates the first surface of the IC die and the proximal ends of the internal gull wing lead structures. In some implementations, the mounting surface further includes a second surface of the IC die opposite the first surface and thus a thermally conductive material may be disposed between the second surface of the IC die and the circuit board.

Abstract: A hard disk drive flying height tester loader which moves a head gimbal assembly (HGA) about the pivot axis of the HGA. The HGA is mounted to a clamp that is attached to a pivot arm. The pivot arm is attached to a cam follower which follows a cam. The cam is moved by a motor that is attached to a stationary sideplate. Movement of the cam rotates the pivot arm, clamp and HGA between a first position and a second position. The pivot arm is Coupled to the stationary sideplate by a ball bearing assembly which has a radius of curvature. The center of the ball bearing radius intersects the pivot axis of the HGA so that the clamp and HGA rotate about the pivot axis when the motor and cam move the pivot arm between the first and second positions.