Patents by Inventor Patkar Rajul Sachin

Patkar Rajul Sachin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polymer anchored microelectromechanical system (MEMS) cantilever and method of fabricating the same
    Patent number: 9731957
    Abstract: A microelectromechanical system (MEMS) cantilever includes a base and a cantilever beam projecting from the base. The cantilever beam includes a piezo layer sandwiched between an inorganic material structural layer and an inorganic material encapsulating and immobilizing layer. A pair of electrical contacts are formed in the encapsulating and immobilizing layer in contact with the piezo layer. The base consists of polymer. A method includes depositing a sacrificial layer on a substrate; forming a MEMS cantilever beam on the sacrificial layer by depositing an inorganic material structural layer thereon; depositing a piezo layer on the structural layer; and depositing an inorganic material encapsulating and immobilizing layer on the piezo layer; forming a pair of electrical contacts in the encapsulating and immobilizing layer in contact with the piezo layer; forming a polymer base for the cantilever beam; and etching the sacrificial layer to release the MEMS cantilever beam from the substrate.
    Type: Grant
    Filed: January 21, 2015
    Date of Patent: August 15, 2017
    Assignee: INDIAN INSTITUTE OF TECHNOLOGY, BOMBAY
    Inventors: Patkar Rajul Sachin, Apte Prakash Ramchandra, Rao Valipe Ramgopal
  • POLYMER ANCHORED MICROELECTROMECHANICAL SYSTEM (MEMS) CANTILEVER AND METHOD OF FABRICATING THE SAME
    Publication number: 20150203345
    Abstract: A microelectromechanical system (MEMS) cantilever includes a base and a cantilever beam projecting from the base. The cantilever beam includes a piezo layer sandwiched between an inorganic material structural layer and an inorganic material encapsulating and immobilising layer. A pair of electrical contacts are formed in the encapsulating and immobilising layer in contact with the piezo layer. The base consists of polymer. A method includes depositing a sacrificial layer on a substrate; forming a MEMS cantilever beam on the sacrificial layer by depositing an inorganic material structural layer thereon; depositing a piezo layer on the structural layer; and depositing an inorganic material encapsulating and immobilising layer on the piezo layer; forming a pair of electrical contacts in the encapsulating and immobilising layer in contact with the piezo layer; forming a polymer base for the cantilever beam; and etching the sacrificial layer to release the MEMS cantilever beam from the substrate.
    Type: Application
    Filed: January 21, 2015
    Publication date: July 23, 2015
    Inventors: Patkar Rajul Sachin, Apte Prakash Ramchandra, Rao Valipe Ramgopal