Patents by Inventor Patricia Bezerra

Patricia Bezerra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transient liquid phase bonding to cold-worked surfaces
    Patent number: 7165712
    Abstract: A joint having bond line grains that nucleate in the joint region and grow into the adjoined solid substrates. The resulting bond line grains have a size that is greater than a thickness of a molten region. The surfaces of the substrates are cold worked to a desired degree of residual stress prior to the bonding process so that the recrystallization of the substrate surface necessary for the grains to grow into the substrates results in a reduction in the local free energy.
    Type: Grant
    Filed: October 23, 2003
    Date of Patent: January 23, 2007
    Assignee: Siemens Power Generation, Inc.
    Inventors: Zafir Abdo, Patricia Bezerra, Paul J. Zombo
  • Solder comprising elemental powder
    Publication number: 20060249231
    Abstract: Solders contain at least one agent for lowering the melting point, but these agents lead to a deterioration in the properties of the component to which the solder is applied. The solder according to the invention has a composition which is identical or similar to that of a solder according to the prior art, but in this case the elements which form a compound with the agent for lowering the melting point are at least partially added in powder form.
    Type: Application
    Filed: April 28, 2006
    Publication date: November 9, 2006
    Inventors: Patricia Bezerra, Michael Ott
  • Transient liquid phase bonding to cold-worked surfaces
    Publication number: 20050087584
    Abstract: A joint (32) having bond line grains (28) that nucleate in the joint region (32) and grow into the adjoined solid substrates (12, 14). The resulting bond line grains have a size that is greater than a thickness (T) of a molten region (15). The surfaces of the substrates are cold worked to a desired degree of residual stress prior to the bonding process so that the recrystallization of the substrate surface necessary for the grains to grow into the substrates results in a reduction in the local free energy.
    Type: Application
    Filed: October 23, 2003
    Publication date: April 28, 2005
    Inventors: Zafir Abdo, Patricia Bezerra, Paul Zombo