Abstract: Phase-change memory device and methods for forming the same. The phase-change memory device comprises a first electrode and at least one phase-change material layer formed over the first electrode. The at least one phase-change material layer further comprising at least one implanted region that has higher thermal characteristics than an adjacent non-implanted region. A second electrode is formed over the at least one phase-change material layer. The phase-change memory device is configured to avoid cross-talk with neighboring phase-change memory devices in a memory array.

Abstract: A method of forming a metal cap over a conductive interconnect in a chalcogenide-based memory device is provided and includes, forming a layer of a first conductive material over a substrate, depositing an insulating layer over the first conductive material and the substrate, forming an opening in the insulating layer to expose at least a portion of the first conductive material, depositing a second conductive material over the insulating layer and within the opening, removing portions of the second conductive material to form a conductive area within the opening, recessing the conductive area within the opening to a level below an upper surface of the insulating layer, forming a cap of a third conductive material over the recessed conductive area within the opening, depositing a stack of a chalcogenide based memory cell material over the cap, and depositing a conductive material over the chalcogenide stack.

Abstract: Phase-change memory device and methods for forming the same. The phase-change memory device comprises a first electrode and at least one phase-change material layer formed over the first electrode. The at least one phase-change material layer further comprising at least one implanted region that has higher thermal characteristics than an adjacent non-implanted region. A second electrode is formed over the at least one phase-change material layer. The phase-change memory device is configured to avoid cross-talk with neighboring phase-change memory devices in a memory array.

Abstract: A method of forming a metal cap over a conductive interconnect in a chalcogenide-based memory device is provided and includes, forming a layer of a first conductive material over a substrate, depositing an insulating layer over the first conductive material and the substrate, forming an opening in the insulating layer to expose at least a portion of the first conductive material, depositing a second conductive material over the insulating layer and within the opening, removing portions of the second conductive material to form a conductive area within the opening, recessing the conductive area within the opening to a level below an upper surface of the insulating layer, forming a cap of a third conductive material over the recessed conductive area within the opening, the third conductive material selected from the group consisting of cobalt, silver, gold, copper, nickel, palladium, platinum, and alloys thereof, depositing a stack of a chalcogenide based memory cell material over the cap, and depositing a cond