Patents by Inventor Patricia S. Brown

Patricia S. Brown has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6442871
    Abstract: A shoe heel includes a rigid heel block that attaches to a shoe sole at the heel seat on the sole and a top lift having a molded base that is located below the heel block such that a space exists between the bottom of the block and the top of the base. This space, along the peripheries of the block and base, contains' a highly resilient skirt, the interior of which is for the most part a void. An elastomeric slug projects from the heel block, through the space, and at its lower end bears against the base of the top lift. The slug, while being resilient, possesses enough firmness to support the weight of an individual over the base of the top lift. The top lift contains pins which project from its base into bores in the heel block to prevent the top lift from rotating under the heel block. The slug, while transferring the weight of the individual to the top lift, attenuates impacts to which the top lift is subjected.
    Type: Grant
    Filed: May 25, 2001
    Date of Patent: September 3, 2002
    Assignee: Brown Shoe Co.
    Inventors: Daniel M. Doerer, Patricia S. Brown, David H. Schwarz
  • Publication number: 20010034957
    Abstract: A shoe heel includes a rigid heel block that attaches to a shoe sole at the heel seat on the sole and a top lift having a molded base that is located below the heel block such that a space exists between the bottom of the block and the top of the base. This space, along the peripheries of the block and base, contains a highly resilient skirt, the interior of which is for the most part a void. An elastomeric slug projects from the heel block, through the space, and at its lower end bears against the base of the top lift. The slug, while being resilient, possesses enough firmness to support the weight of an individual over the base of the top lift. The top lift contains pins which project from its base into bores in the heel block to prevent the top lift from rotating under the heel block. The slug, while transferring the weight of the individual to the top lift, attenuates impacts to which the top lift is subjected.
    Type: Application
    Filed: May 25, 2001
    Publication date: November 1, 2001
    Inventors: Daniel M. Doerer, Patricia S. Brown, David H. Schwartz
  • Patent number: 5610642
    Abstract: A versatile flexible interconnect circuit for use with an inkjet printer. The inventive flexible interconnect circuit comprises a unitary flexible substrate having a first end and a second end. A first plurality of contacts is arranged on the first end of the substrate in a first configuration. A first plurality of conductive traces connects the first plurality of contacts to a second plurality of contacts disposed on the second end of the substrate. A third plurality of contacts is arranged on the first end of the substrate in a second configuration. A second plurality of conductive traces connects the third plurality of contacts to a fourth plurality of contacts disposed on the second end of the substrate. In a specific embodiment, the first plurality of contacts includes plural electrical ground contacts and the first plurality of conductive traces includes a conductive trace which connects the electrical ground contacts.
    Type: Grant
    Filed: April 28, 1994
    Date of Patent: March 11, 1997
    Assignee: Hewlett-Packard Company
    Inventors: Gary M. Nobel, Todd Medin, Arthur K. Wilson, Patricia S. Brown
  • Patent number: 5608434
    Abstract: An improved electrical interconnect system for a flexible circuit which includes: a flexible first layer; at least one protrusion on the flexible first layer that has an electrical contact; a second layer having at least one electrical contact; and a spring apparatus coupled to the flexible first layer and to the second layer for pressing the electrical contact on a protrusion on the flexible first layer to the electrical contact on the second layer to electrically connect the electrical contact on the protrusion to the electrical contact on the second layer. In a specific embodiment the spring apparatus for pressing the electrical contact on the protrusion of the flexible first layer to the electrical contact on the second layer includes relief for allowing the flexible first layer to deform during assembly of the improved electrical interconnect system for a flexible circuit.
    Type: Grant
    Filed: October 12, 1994
    Date of Patent: March 4, 1997
    Assignee: Hewlett-Packard Company
    Inventors: Arthur K. Wilson, Patricia S. Brown, Jason R. Arbeiter
  • Patent number: 5598194
    Abstract: An apparatus and method for providing proper electrical contact between corresponding interconnect pads of a print cartridge and a print carriage are disclosed. One end of a flex circuit having interconnect pads of the print carriage is attached to one side of the print carriage while the other end of the flex circuit may be substantially free or attached to an opposing side of the print carriage. When the print cartridge is initially inserted into the print carriage, a gimbal spring causes the flex circuit interconnect pads to preliminarily come in contact with the print cartridge interconnect pads before the print cartridge is completely inserted. As the print cartridge is further inserted, the print cartridge pushes out any excess slack in the flex circuit while providing a wiping action between the interconnect pads of the print cartridge and the flex circuit. This wiping action between the interconnect pads scrapes away any contaminants and corrosion, thus ensuring reliable electrical contact.
    Type: Grant
    Filed: April 30, 1993
    Date of Patent: January 28, 1997
    Assignee: Hewlett-Packard Company
    Inventors: Corrina A. E. Hall, W. Wistar Rhoads, Patricia S. Brown, Arthur K. Wilson
  • Patent number: 5533904
    Abstract: An improved interconnect system for an inkjet printer. The inventive interconnect system includes first and second unitary flexible circuits having first and second sets of contacts, respectively, for providing first and second electrical interconnections, respectively. The first and second flexible circuits are aligned and retained so that contacts thereon engage corresponding contacts disposed on a rigid support. In a specific implementation, the first flexible circuit is aligned by a first set of pins arranged along a first axis and the flexible circuit is aligned by a second set of pins arranged along a second axis, perpendicular to the first axis. This arrangement allows for the alignment and mounting of two flexible circuits on a single printer carriage without a substantial increase in the width thereof.
    Type: Grant
    Filed: April 28, 1994
    Date of Patent: July 9, 1996
    Assignee: Hewlett-Packard Company
    Inventors: Gary M. Nobel, Arthur K. Wilson, Patricia S. Brown, Jason R. Arbeiter
  • Patent number: 5372512
    Abstract: An improved electrical interconnect system for a flexible circuit which includes: a flexible first layer; at least one protrusion on the flexible first layer that has an electrical contact; a second layer having at least one electrical contact; and a spring apparatus coupled to the flexible first layer and to the second layer for pressing the electrical contact on the protrusion on the flexible first layer to the electrical contact on the second layer to electrically connect the electrical contact on the protrusion to the electrical contact on the second layer. In a specific embodiment the spring apparatus for pressing the electrical contact on the protrusion of the flexible first layer to the electrical contact on the second layer includes relief for allowing the flexible first layer to deform during assembly of the improved electrical interconnect system for a flexible circuit.
    Type: Grant
    Filed: April 30, 1993
    Date of Patent: December 13, 1994
    Assignee: Hewlett-Packard Company
    Inventors: Arthur K. Wilson, Patricia S. Brown, Jason R. Arbeiter