Patents by Inventor Patricia Sabran Conde

Patricia Sabran Conde has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process of making a stacked semiconductor package having a clip
    Patent number: 8883567
    Abstract: A method of making a stacked semiconductor package having at least a leadframe, a first die mounted above and soldered to the lead frame and a first clip mounted above and soldered to the first die. The method includes positioning the leadframe, first die and first clip in a vertically stacked relationship and nonsolderingly locking the first clip in laterally nondisplaceble relationship with the leadframe. A stacked semiconductor package and an intermediate product produced in making a stacked semiconductor package are also disclosed.
    Type: Grant
    Filed: March 27, 2012
    Date of Patent: November 11, 2014
    Assignee: Texas Instruments Incorporated
    Inventors: Michael Todd Wyant, Patricia Sabran Conde, Vikas Gupta, Rajiv Dunne, Emerson Mamaril Enipin
  • Stacked Semiconductor Package
    Publication number: 20130256852
    Abstract: A method of making a stacked semiconductor package having at least a leadframe, a first die mounted above and soldered to the lead frame and a first clip mounted above and soldered to the first die. The method includes positioning the leadframe, first die and first clip in a vertically stacked relationship and nonsolderingly locking the first clip in laterally nondisplaceble relationship with the leadframe. A stacked semiconductor package and an intermediate product produced in making a stacked semiconductor package are also disclosed.
    Type: Application
    Filed: March 27, 2012
    Publication date: October 3, 2013
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Michael Todd Wyant, Patricia Sabran Conde, Vikas Gupta, Rajiv Dunne, Emerson Mamaril Enipin