Abstract: A computing device includes an interface configured to interface and communicate with a communication system, a memory that stores operational instructions, and processing circuitry operably coupled to the interface and to the memory that is configured to execute the operational instructions to perform various operations. The computing device processes an input value (e.g., associated with a key) based on a blinding key (e.g., homomorphic encryption) to generate a blinded value and generates an Oblivious Key Access Request (OKAR). The computing device transmits the OKAR to another computing device (e.g., associated with a Key Management System (KMS) service) and receives a blinded key therefrom that is based on a Partially-Oblivious Pseudorandom Function (P-OPRF). The computing device processes the blinded key based on the blinding key (e.g., homomorphic decryption) to generate the key (e.g., associated with the input value). In some examples, the computing device accesses secure information based on the key.

Abstract: A computing device is configured to divide an Oblivious Pseudorandom Function (OPRF) key to generate a plurality of N partial keys, distribute a respective one of the plurality of N partial keys to a corresponding plurality of N Key Management System (KMS) units. The computing device receives from a threshold number T of KMS units, a plurality T partial blinded keys, wherein the plurality T partial blinded keys are based on processing of a value of a blinded key received by a respective KMS unit and a corresponding stored partial key of the N partial keys, combines the plurality T of partial blinded keys into the blinded key, processes the blinded key based on the blinding key in accordance with an OPRF unblinding operation to generate a key and accesses secure information based on the key.

Abstract: A computing device is configured to divide an Oblivious Pseudorandom Function (OPRF) key to generate a plurality of N partial keys, distribute a respective one of the plurality of N partial keys to a corresponding plurality of N Key Management System (KMS) units. The computing device receives from a threshold number T of KMS units, a plurality T partial blinded keys, wherein the plurality T partial blinded keys are based on processing of a value of a blinded key received by a respective KMS unit and a corresponding stored partial key of the N partial keys, combines the plurality T of partial blinded keys into the blinded key, processes the blinded key based on the blinding key in accordance with an OPRF unblinding operation to generate a key and accesses secure information based on the key.

Abstract: A computing device includes an interface configured to interface and communicate with a communication system, a memory that stores operational instructions, and processing circuitry operably coupled to the interface and to the memory that is configured to execute the operational instructions to perform various operations. The computing device processes an input value (e.g., associated with a key) based on a blinding key (e.g., homomorphic encryption) to generate a blinded value and generates an Oblivious Key Access Request (OKAR). The computing device transmits the OKAR to another computing device (e.g., associated with a Key Management System (KMS) service) and receives a blinded key therefrom that is based on a Partially-Oblivious Pseudorandom Function (P-OPRF). The computing device processes the blinded key based on the blinding key (e.g., homomorphic decryption) to generate the key (e.g., associated with the input value). In some examples, the computing device accesses secure information based on the key.

Abstract: A system, method and computer program product to train a user to reproduce a reference motion with a haptic feedback system having one or more sensors. The method includes receiving a user-selection of a reference motion pattern, selected from a plurality of motion patterns each of which is machine-interpretable as a time-ordered sequence of reference datasets. The sequence corresponds to a respective reference motion. The method includes capturing a user motion of a user attempting to reproduce the reference motion corresponding to the selected, reference motion pattern. This is accomplished by sampling, via the haptic feedback system, sensor values obtained from the one or more sensors, to obtain appraisal datasets that are representative of the captured user motion. A real-time haptic feedback is provided to the user while capturing the user motion based on comparisons between the appraisal datasets obtained and the reference datasets of the selected, reference motion pattern.

Abstract: The present invention is notably directed to a printed circuit board, or PCB. This PCB has two main surfaces, each delimited by lateral edges, as well as lateral surfaces, each meeting each of the two main surfaces at one lateral edge. The present PCB further comprises a row of solder pads, which extends along a lateral edge of the PCB. Each solder pad is formed directly at the lateral edge and/or directly on a lateral surface (meeting one of the two main surfaces at said lateral edge). I.e., each pad interrupts a lateral edge and/or an adjoining lateral surface. One or more chips, e.g., memory chips, can be mounted on such a PCB to form an IC package. The above solder pad arrangement allows particularly dense arrangements of IC packages to be obtained. The present invention is further directed to related devices and methods of fabrication thereof.

Abstract: The present invention is notably directed to a printed circuit board, or PCB. This PCB has two main surfaces, each delimited by lateral edges, as well as lateral surfaces, each meeting each of the two main surfaces at one lateral edge. The present PCB further comprises a row of solder pads, which extends along a lateral edge of the PCB. Each solder pad is formed directly at the lateral edge and/or directly on a lateral surface (meeting one of the two main surfaces at said lateral edge). I.e., each pad interrupts a lateral edge and/or an adjoining lateral surface. One or more chips, e.g., memory chips, can be mounted on such a PCB to form an IC package. The above solder pad arrangement allows particularly dense arrangements of IC packages to be obtained. The present invention is further directed to related devices and methods of fabrication thereof.