Abstract: A method of determining an overlay value of a substrate, the method including: obtaining temperature data that includes data on measured temperature at one or more positions on a substrate table after a substrate has been loaded onto the substrate table; and determining an overlay value of the substrate in dependence on the obtained temperature data. There is further disclosed a method of determining a performance of a clamping by a substrate table using a determined overlay value.

Abstract: A method of determining an overlay value of a substrate, the method including: obtaining temperature data that includes data on measured temperature at one or more positions on a substrate table after a substrate has been loaded onto the substrate table; and determining an overlay value of the substrate in dependence on the obtained temperature data. There is further disclosed a method of determining a performance of a clamping by a substrate table using a determined overlay value.

Abstract: A device manufacturing method includes: confining a liquid to an immersion space between a projection system and an object; starting application of an underpressure to an extraction unit to remove fluid from a position proximate an edge of the object before the immersion space moves onto the object; moving the support table along a route comprising a series of motions such that a plurality of target positions on the object pass under the projection system; projecting through the immersion space a beam onto the target portions as the target portions pass under the projection system, the projecting performed to account for a certain predetermined thermal profile in the object; and stopping application of the underpressure at a predetermined time after the immersion space moves off the object for the last time during the series of motions to at least partly induce the certain predetermined thermal profile in the object.

Abstract: A measurement substrate for measuring a condition pertaining in an apparatus for processing production substrates during operation thereof, the measurement substrate including: a body having dimensions compatible with the apparatus; a plurality of sensor modules embedded in the body, each sensor module having: a sensor configured generate an analog measurement signal, an analog to digital converter to generate digital measurement information from the analog measurement signal, and a module controller configured to output the digital measurement information; and a central control module configured to receive the digital measurement information from each of the module controllers and to communicate the digital measurement information to an external device.

Abstract: A device manufacturing method includes: confining a liquid to an immersion space between a projection system and an object; starting application of an underpressure to an extraction unit to remove fluid from a position proximate an edge of the object before the immersion space moves onto the object; moving the support table along a route comprising a series of motions such that a plurality of target positions on the object pass under the projection system; projecting through the immersion space a beam onto the target portions as the target portions pass under the projection system, the projecting performed to account for a certain predetermined thermal profile in the object; and stopping application of the underpressure at a predetermined time after the immersion space moves off the object for the last time during the series of motions to at least partly induce the certain predetermined thermal profile in the object.

Abstract: A lithographic apparatus comprising an object table which carries an object. The lithographic apparatus may further comprise at least one sensor as part of a measurement system to measure a characteristic of the object table, the environment surrounding the lithographic apparatus or another component of the lithographic apparatus. The measured characteristic may be used to estimate the deformation of the object due to varying loads during operation of the lithographic apparatus, for example varying loads induced by a two-phase flow in a channel formed within the object table. Additionally, or alternatively, the lithographic apparatus comprises a predictor to estimate the deformation of the object based on a model. The positioning of the object table carrying the object can be controlled based on the estimated deformation.

Abstract: A lithographic apparatus comprising an object table which carries an object. The lithographic apparatus may further comprise at least one sensor as part of a measurement system to measure a characteristic of the object table, the environment surrounding the lithographic apparatus or another component of the lithographic apparatus. The measured characteristic may be used to estimate the deformation of the object due to varying loads during operation of the lithographic apparatus, for example varying loads induced by a two- phase flow in a channel formed within the object table. Additionally, or alternatively, the lithographic apparatus comprises a predictor to estimate the deformation of the object based on a model. The positioning of the object table carrying the object can be controlled based on the estimated deformation.

Abstract: A lithographic apparatus comprising includes an object table which carries an object. The lithographic apparatus may further comprise at least one include a sensor as part of a measurement system to measure a characteristic of the object table, the environment surrounding the lithographic apparatus or another component of the lithographic apparatus. The measured characteristic may be used to estimate the a deformation of the an object due to a varying loads load during operation of the lithographic apparatus, for example a varying loads load induced by a two-phase flow in a channel formed within of the object table. Additionally, or alternatively, the The lithographic apparatus comprises may include a predictor to estimate the deformation of the object based on a model. The positioning of the object table carrying the object can be controlled based on the estimated deformation.