Patents by Inventor Patrick A. Coico
Patrick A. Coico has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 9402334Abstract: An air flow control assembly, system, and method for controlling air flow to a server rack. An example air flow control assembly includes a retractable barrier configured to block the air flow, at least partially, from passing through a perforated floor tile to the server rack. The air flow control assembly also includes a barrier mount configured to secure the retractable barrier proximate the perforated floor tile.Type: GrantFiled: December 8, 2013Date of Patent: July 26, 2016Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Patrick A. Coico, David P. Graybill, Allan R. Hoeft, Madhusudan K. Iyengar, Roger R. Schmidt, Gerard V. Weber, Jr.
-
Patent number: 9132519Abstract: A method is provided for fabricating a cooling apparatus for cooling an electronics rack, which includes an air-to-liquid heat exchanger, one or more coolant-cooled structures, and a tube. The heat exchanger is associated with the electronics rack and disposed to cool air passing through the rack, includes a plurality of coolant-carrying tube sections, each tube section having a coolant inlet and outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section. The coolant-cooled structure(s) is in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant. The tube connects in fluid communication one coolant-cooled structure and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger and the coolant-cooled structure.Type: GrantFiled: December 12, 2012Date of Patent: September 15, 2015Assignee: INTERNTIONAL BUSINESS MACHINES CORPORATIONInventors: Timothy J. Chainer, Patrick A. Coico, David P. Graybill, Madhusudan K. Iyengar, Vinod Kamath, Bejoy J. Kochuparambil, Roger R. Schmidt, Mark E. Steinke
-
Publication number: 20140090806Abstract: An air flow control assembly, system, and method for controlling air flow to a server rack. An example air flow control assembly includes a retractable barrier configured to block the air flow, at least partially, from passing through a perforated floor tile to the server rack. The air flow control assembly also includes a barrier mount configured to secure the retractable barrier proximate the perforated floor tile.Type: ApplicationFiled: December 8, 2013Publication date: April 3, 2014Applicant: International Business Machines CorporationInventors: Patrick A. Coico, David P. Graybill, Allan R. Hoeft, Madhusudan K. Iyengar, Roger R. Schmidt, Gerard V. Weber, JR.
-
Patent number: 8687364Abstract: A cooling apparatus for an electronics rack is provided which includes an air-to-liquid heat exchanger, one or more coolant-cooled structures and a tube. The heat exchanger, which is associated with the electronics rack and disposed to cool air passing through the rack, includes a plurality of distinct, coolant-carrying tube sections, each tube section having a coolant inlet and a coolant outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section. The coolant-cooled structure(s) is in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant. The tube connects in fluid communication one coolant-cooled structure and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger and the coolant-cooled structure.Type: GrantFiled: October 28, 2011Date of Patent: April 1, 2014Assignee: International Business Machines CorporationInventors: Timothy J. Chainer, Patrick A. Coico, David P. Graybill, Madhusudan K. Iyengar, Vinod Kamath, Bejoy J. Kochuparambil, Roger R. Schmidt, Mark E. Steinke
-
Publication number: 20130107453Abstract: A cooling apparatus for an electronics rack is provided which includes an air-to-liquid heat exchanger, one or more coolant-cooled structures and a tube. The heat exchanger, which is associated with the electronics rack and disposed to cool air passing through the rack, includes a plurality of distinct, coolant-carrying tube sections, each tube section having a coolant inlet and a coolant outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section. The coolant-cooled structure(s) is in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant. The tube connects in fluid communication one coolant-cooled structure and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger and the coolant-cooled structure.Type: ApplicationFiled: October 28, 2011Publication date: May 2, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Timothy J. CHAINER, Patrick A. COICO, David P. GRAYBILL, Madhusudan K. IYENGAR, Vinod KAMATH, Bejoy J. KOCHUPARAMBIL, Roger R. SCHMIDT, Mark E. STEINKE
-
Publication number: 20130000736Abstract: An air flow control assembly, system, and method for controlling air flow to a server rack. An example air flow control assembly includes a retractable barrier configured to block the air flow, at least partially, from passing through a perforated floor tile to the server rack. The air flow control assembly also includes a barrier mount configured to secure the retractable barrier proximate the perforated floor tile.Type: ApplicationFiled: June 29, 2011Publication date: January 3, 2013Applicant: International Business Machines CorporationInventors: Patrick A. Coico, David P. Graybill, Allan R. Hoeft, Madhusudan K. Iyengar, Roger R. Schmidt, Gerard V. Weber, JR.
-
Patent number: 7724527Abstract: A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one chip to a desired surface profile; applying a heat transfer medium on at least one of a heat sink and the second side of the at least one chip; and disposing the heat sink on the second side of the at least one chip with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip. The gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink.Type: GrantFiled: August 25, 2008Date of Patent: May 25, 2010Assignee: International Business Machines CorporationInventors: Patrick A. Coico, David L. Edwards, Richard F. Indyk, David C. Long
-
Patent number: 7518235Abstract: An integrated circuit chip mounting structure includes a chip carrier electrically connected to a circuit board with an integrated circuit chip mounted on the chip carrier. In addition, a thermally conductive device is thermally connected to the chip and a set of compressible support members are provided to transmit a portion of an applied compressive load from the thermally conductive device to the chip and chip carrier.Type: GrantFiled: March 8, 2005Date of Patent: April 14, 2009Assignee: International Business Machines CorporationInventors: Patrick A. Coico, David L. Edwards, Benjamin V. Fasano, Lewis S. Goldmann, Ellyn M. Ingalls, Michael S. June, Hilton T. Toy, Paul A. Zucco
-
Patent number: 7468886Abstract: A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one chip to a desired surface profile; applying a heat transfer medium on at least one of a heat sink and the second side of the at least one chip; and disposing the heat sink on the second side of the at least one chip with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip. The gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink.Type: GrantFiled: March 5, 2007Date of Patent: December 23, 2008Assignee: International Business Machines CorporationInventors: Patrick A. Coico, David L. Edwards, Richard F. Indyk, David C. Long
-
Publication number: 20080310117Abstract: A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one chip to a desired surface profile; applying a heat transfer medium on at least one of a heat sink and the second side of the at least one chip; and disposing the heat sink on the second side of the at least one chip with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip. The gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink.Type: ApplicationFiled: August 25, 2008Publication date: December 18, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Patrick A. Coico, David L. Edwards, Richard F. Indyk, David C. Long
-
Publication number: 20080218971Abstract: A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one chip to a desired surface profile; applying a heat transfer medium on at least one of a heat sink and the second side of the at least one chip; and disposing the heat sink on the second side of the at least one chip with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip. The gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink.Type: ApplicationFiled: March 5, 2007Publication date: September 11, 2008Applicant: International Business Machines CorporationInventors: Patrick A. Coico, David L. Edwards, Richard F. Indyk, David C. Long
-
Publication number: 20080076690Abstract: A depolymerization cleaning solution, and method of using such solution, for removing undesirable thermoset polymer sealants residing on electronic components to provide such components with a clean seal surface for a subsequent rework process. The depolymerization cleaning solution includes a premixed metal hydroxide or amino onium salt saturated solution having a surfactant. It is particularly useful for the localized deposition and removal of thermoset polymer sealants, such as polysiloxanes, within sealband areas of the components, which have been applied on such components with different levels of chemical inertness. The material set and method disclosed in the present invention are the basis for a low cost electronic package adhesive rework process.Type: ApplicationFiled: October 2, 2007Publication date: March 27, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Patrick Coico, James Covell, Brenda Peterson, Frank Pompeo, Deborah Sylvester, Tsong-Lin Tai, Jaimal Williamson, Jiali Wu
-
Publication number: 20060202325Abstract: An integrated circuit chip mounting structure includes a chip carrier electrically connected to a circuit board with an integrated circuit chip mounted on the chip carrier. In addition, a thermally conductive device is thermally connected to the chip and a set of compressible support members are provided to transmit a portion of an applied compressive load from the thermally conductive device to the chip and chip carrier.Type: ApplicationFiled: March 8, 2005Publication date: September 14, 2006Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Patrick Coico, David Edwards, Benjamin Fasano, Lewis Goldmann, Ellyn Ingalls, Michael June, Hilton Toy, Paul Zucco
-
Patent number: 6955543Abstract: A system and method to form a reworkable compression seal between an electronic module and a cap are disclosed. The system and method include an electronic module having a tapered edge configured on at least a portion of the edge defining a perimeter of the electronic module and the cap configured with an opening to receive the electronic module therein. A compression seal is disposed with the cap and is configured to surround one or more chips or other electronic components on the electronic module to form a seal between the electronic module and the cap. A plurality of side loaders are operably coupled to the cap and aligned to receive the tapered edge on the electronic module. Each side loader is configured to engage the tapered edge and provide sufficient compressive force to the compression seal disposed between the electronic module and the cap.Type: GrantFiled: August 11, 2003Date of Patent: October 18, 2005Assignee: International Business Machines CorporationInventors: Gaetano P. Messina, Patrick A. Coico, Lewis S. Goldmann, Richard F. Indyk, Vladimir Jambrih, Jeffrey A. Zitz
-
Patent number: 6908025Abstract: A process and apparatus for preparing an MCM for hat removal where the hat includes a piston thermally coupled to a corresponding chip. The apparatus includes a heater positioned to reflow a joint between the piston and a base of the hat; and a retractor for biasing the piston away from the corresponding chip. Implementation of the apparatus and process prevent a piston, as it moves across the top of a corresponding chip during mechanical shear to remove the hat, to impact chip(s) and surrounding components. In addition, since piston(s) are retracted, the likelihood of piston impact with or cracking of a chip is reduced. In addition, cutting into a corresponding chip having a tilted back surface is prevented. The need to replace chips and other electronic components when making other repairs may, therefore, be greatly reduced.Type: GrantFiled: June 26, 2003Date of Patent: June 21, 2005Assignee: Internatioanl Business Machines CorporationInventors: Patrick A. Coico, Steven P. Ostrander, Sudipta K. Ray
-
Publication number: 20050066995Abstract: A depolymerization cleaning solution, and method of using such solution, for removing undesirable thermoset polymer sealants residing on electronic components to provide such components with a clean seal surface for a subsequent rework process. The depolymerization cleaning solution includes a premixed metal hydroxide or amino onium salt saturated solution having a surfactant. It is particularly useful for the localized deposition and removal of thermoset polymer sealants, such as polysiloxanes, within sealband areas of the components, which have been applied on such components with different levels of chemical inertness. The material set and method disclosed in the present invention are the basis for a low cost electronic package adhesive rework process.Type: ApplicationFiled: September 30, 2003Publication date: March 31, 2005Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Patrick Coico, James Covell, Brenda Peterson, Frank. Pompeo, Deborah Sylvester, Tsong-Lin Tai, Jaimal Williamson, Jiali Wu
-
Publication number: 20050037640Abstract: A system and method to form a reworkable compression seal between an electronic module and a cap are disclosed. The system and method include an electronic module having a tapered edge configured on at least a portion of the edge defining a perimeter of the electronic module and the cap configured with an opening to receive the electronic module therein. A compression seal is disposed with the cap and is configured to surround one or more chips or other electronic components on the electronic module to form a seal between the electronic module and the cap. A plurality of side loaders are operably coupled to the cap and aligned to receive the tapered edge on the electronic module. Each side loader is configured to engage the tapered edge and provide sufficient compressive force to the compression seal disposed between the electronic module and the cap.Type: ApplicationFiled: August 11, 2003Publication date: February 17, 2005Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gaetano Messina, Patrick Coico, Lewis Goldmann, Richard Indyk, Vladimir Jambrih, Jeffrey Zitz
-
Publication number: 20040262371Abstract: A process and apparatus for preparing an MCM for hat removal where the hat includes a piston thermally coupled to a corresponding chip. The apparatus includes a heater positioned to reflow a joint between the piston and a base of the hat; and a retractor for biasing the piston away from the corresponding chip. Implementation of the apparatus and process prevent a piston, as it moves across the top of a corresponding chip during mechanical shear to remove the hat, to impact chip(s) and surrounding components. In addition, since piston(s) are retracted, the likelihood of piston impact with or cracking of a chip is reduced. In addition, cutting into a corresponding chip having a tilted back surface is prevented. The need to replace chips and other electronic components when making other repairs may, therefore, be greatly reduced.Type: ApplicationFiled: June 26, 2003Publication date: December 30, 2004Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Patrick A. Coico, Steven P. Ostrander, Sudipta K. Ray
-
Patent number: 6354844Abstract: A Land Grid Array electronic package having an array of contact pads is connected to a corresponding array of contact pads on a circuit board through a matching array of conductive pins of a flexible interposer. Alignment of the electronic package to the flexible interposer and flexible interposer to the circuit board is obtained by registration of alignment components to the contact pads and conductive pins. A pair of alignment components, such as pin-like alignment structures, on selected pads of both the electronic package and circuit board mate within alignment holes at the sites of corresponding pin locations in said flexible interposer. Alternatively, the pin-like alignment structures on the electronic package can be extended to pass through the said alignment holes of said flexible interposer into alignment holes which replace the pin-like alignment structure on said circuit board.Type: GrantFiled: December 13, 1999Date of Patent: March 12, 2002Assignee: International Business Machines CorporationInventors: Patrick A. Coico, Benjamin V. Fasano
-
Patent number: 6339534Abstract: An area array integrated circuit package having contact pads is provided with compliant rectangular shaped connection leads each attached to a contact pad. The leads are arranged and oriented on the surface of the package around the neutral point of the package such that the flat width dimension of each lead faces the neutral point of the contact array, thereby offering optimal compliance against thermally induced deformation and resulting in improved interconnection reliability.Type: GrantFiled: November 5, 1999Date of Patent: January 15, 2002Assignee: International Business Machines CorporationInventors: Patrick A. Coico, Luc Guerin