Abstract: A dual gauge lead frame 36 is provided, including at least one mating surface 14 and a plurality of terminal arms 16 formed into a flat circuit surface 12 having a first gauge 32. Each of the plurality of terminal arms 16 includes a fold over terminal arm portion 28 folded over and coined into a base terminal arm portion 26 to form a plurality of end posts 30. The plurality of end posts 30 form a second gauge 34.

Abstract: A dual gauge lead frame 36 is provided, including at least one mating surface 14 and a plurality of terminal arms 16 formed into a flat circuit surface 12 having a first gauge 32. Each of the plurality of terminal arms 16 includes a fold over terminal arm portion 28 folded over and coined into a base terminal arm portion 26 to form a plurality of end posts 30. The plurality of end posts 30 form a second gauge 34.

Abstract: An IC power package particularly suitable for use as a rectifier for an automotive ac generator, as well as an IC packaging method. The power package comprises an electrically-conductive base, a MOSFET die mounted to the base so that the drain region of the MOSFET is electrically connected to the base, an electrically-conductive pin mounted to the die and electrically connected to the source region of the MOSFET, and an electrically-conductive member electrically connected to the gate region of the MOSFET. The conductive member can take several forms, including a second pin or a leadframe mounted to the die, or an annular-shaped member mounted to the base by an electrically-insulative member. In the latter embodiment, the annular-shaped member may be electrically connected to the gate region with a bond wire. The die is preferably encapsulated on the base, so that the base, pin and conductive member provide three connections for a rugged IC package.