Abstract: A telephone is provided with a port for disconnectably connecting an external information source, such as an MP3 player, to the telephone, and an on-hold function that operates while a call of the telephone is on hold and either presents to the telephone's user the information from the external source if the external source is connected, or presents to the user on-hold information from a telephone network if the external source is not connected, or presents silence at the user's option, irrespective of whether or not the external source is connected.

Abstract: A therapeutic posture aid apparatus designed to properly align all three curves of the spine, hold the shoulder girdle in a proper posture position, allow full range of motion of all joints in the back, neck, shoulders and arms, reminding the wearer to move his/her back, neck and shoulders into a proper posture to eliminate/relieve, back pain, stress and muscle fatigue.

Abstract: A time based digital to analog converter is presented in which known reference voltages are used to create variable period waveforms which, when combined according to a desired computation, can convert digital words into a sinusoidal signal of a precision variable. To illustrate the application of the present invention, a hemispherical resonator gyroscope (HRG) operating in force rebalance is presented wherein a time based digital to analog converter with a variable period output controls the HRG electronics in nulling the standing wave. A rate of the standing wave is calculated, and a software component calculates the fraction of the maximum rate needed to oppose and null the initial rate of the standing wave. The fraction of the maximum rate is converted to digital words corresponding to the number of periods of a clock connected to the circuit.

Abstract: An electronic packaging structure, and a method of making this structure, are disclosed. The electronic packaging structure comprises a full panel, circuitized flexible film semiconductor chip carrier mounted on a circuitized substrate such as a printed circuit board. A plurality of semiconductor chips are mounted on the carrier in a selected pattern, and the carrier, with the chips, is mounted on a matching pattern of bonding sites on the circuitized substrate. Preferably, the circuitized flexible film semiconductor chip carrier is manufactured on a support structure used to facilitate handling of the circuitized flexible film and to facilitate heat transfer from the semiconductor chips mounted on the carrier to a heat sink which is part of the circuitized substrate. Also, the semiconductor chips mounted on the flexible film chip carrier may be tested, and burned in, while on the support structure before the chip carrier, with the chips, is mounted on the circuitized substrate.

Abstract: An electronic packaging structure, and a method of making this structure, are disclosed. The electronic packaging structure comprises a full panel, circuitized flexible film semiconductor chip carrier mounted on a circuitized substrate such as a printed circuit board. A plurality of semiconductor chips are mounted on the carrier in a selected pattern, and the carrier, with the chips, is mounted on a matching pattern of bonding sites on the circuitized substrate. Preferably, the circuitized flexible film semiconductor chip carrier is manufactured on a support structure used to facilitate handling of the circuitized flexible film and to facilitate heat transfer from the semiconductor chips mounted on a carrier to a heat sink which is part of the circuitized substrate. Also, the semiconductor chip mounted on the flexible film chip carrier may be tested, and burned in, while on the support structure before the chip carrier, with the chips, is mounted on the circuitized substrate.