Abstract: An improvement to a semi-autonomous apparatus is described herein. In an apparatus having a gantry subassembly, a tram subassembly movably mounted on the gantry subassembly, and an actuation subassembly mounted on the tram subassembly, the improvement includes a gripper subassembly operatively connected to the actuation subassembly. The movement of the subassemblies is controlled in part by a control system that controls drive systems associated with one or more of the subassemblies. The gantry subassembly includes a bridge member for laterally spanning a selected section of a work site. The tram subassembly includes a tram that travels laterally along to the bridge member. The actuation subassembly includes at least one motion actuator for controlling the movement of the gripper subassembly in a generally vertical direction and may include an additional motion actuator for movement in a generally horizontal direction.

Abstract: An apparatus for testing magnetic heads that interact with magnetic disks includes a translational slide and a rotatable arm mounted to one end of the slide. The translational slide moves the rotatable arm in a longitudinal direction parallel to the surface of a magnetic disk. The arm rotates the magnetic head to different positions relative to data tracks on the disk. A second translational slide moves the magnetic head vertically above the disk to adjust the vertical position of the head. The three movements of the head, (1)horizontally across the disk, (2)rotationally by the arm, and (3)vertically relative to the disk surface are controlled by servomechanisms. A read/write amplifier circuit is connected to the head under test. The test apparatus is controlled by a computer that interfaces with circuitry connected to the servomechanisms.

Abstract: A test mixture for testing a head gimbal assembly has a flex interconnect circuit with one or more test pads, and includes a clamp assembly and a connector board. The clamp assembly is secured to the connector board for locking the test pads in position. The connector board includes probing pins that contact the test pads in order to establish an electrical path with the head gimbal assembly. The clamp assembly includes a base and a self-locking mechanism, with the base serving as an interface between the self-locking mechanism and the connector board. The self-locking mechanism serves to position the test pads in a desired relation relative to the probing pins and to clamp the test pads during testing. The self-locking mechanism includes a clamp arm having a guiding slide that receives part of the flex interconnect circuit for positioning the test pads within the self-locking mechanism. The connector board is secured to a magnetic test cartridge.

Abstract: An apparatus for testing magnetic heads that interact with magnetic disks includes a translational slide and a rotatable arm mounted to one end of the slide. The translational slide moves the rotatable arm in a longitudinal direction parallel to the surface of a magnetic disk. The arm rotates the magnetic head to different positions relative to data tracks on the disk. A second translational slide moves the magnetic head vertically above the disk to adjust the vertical position of the head. The three movements of the head, (1)horizontally across the disk, (2)rotationally by the arm, and (3)vertically relative to the disk surface are controlled by servomechanisms. A read/write amplifier circuit is connected to the head under test. The test apparatus is controlled by a computer that interfaces with circuitry connected to the servomechanisms.

Abstract: A method of stretching solder joints between the input/output pads of an electrical component and corresponding input/output pads on a substrate includes the steps of: melting the solder joints; confining the component while the solder joints are melted such that the component can only move substantially perpendicular to the substrate; pulling the component, while the component is confined, by an external force in a direction away from the substrate to thereby stretch the melted solder joints; compelling the movement of the component to stop when the component has moved a predetermined distance; and, solidifying the solder joints while the component is compelled to stop. By stretching the solder joints with the above method, the solder joint shape can be changed from convex to concave; and thermally induced stress/strain in the joint is substantially reduced.