Abstract: A method for manufacturing a spark plug. The method includes: furnishing an insulator; introducing into the insulator a material mixture that is configured to constitute a resistor paste, the material mixture containing ZrO2 and SiO2; heating the insulator and the material mixture present therein to a temperature T of at least 870° C., so that ZrO2 and SiO2 in the material mixture react at least partly to ZrSiO4.

Abstract: Microelectronics having form factors (e.g., dimensions and functionality) comparable with traditional microelectronics, but with considerably simplified design, and their methods of manufacture are provided. Microelectronics and methods that implement microelectronics are capable of being forming without the need for through-vias. Exemplary dielectrics in these embodiments include, but are not limited to, high Q, temperature stable and high k dielectrics. Microelectronics and methods are capable of combination with any other passive electronic component such as a resistor or inductor further improving functionality and reducing space requirements on the circuit. Microelectronics and methods are configured to be mounted to a short block or other device without the use of a through-via, simplifying connection to a circuit.

Abstract: A method for manufacturing a spark plug. The method includes: furnishing an insulator; introducing into the insulator a material mixture that is configured to constitute a resistor paste, the material mixture containing ZrO2 and SiO2; heating the insulator and the material mixture present therein to a temperature T of at least 870° C., so that ZrO2 and SiO2 in the material mixture react at least partly to ZrSiO4.

Abstract: Capacitors having form factors (e.g., dimensions and functionality) comparable with traditional single layer capacitors, but with considerably higher capacitance and methods of their manufacture are provided. Capacitors and methods that implement capacitors where at least one of the dielectric layers is reduced in thickness post firing to produce a device robust enough for automated handling and provide a stable surface for wire-bonding are also provided. Capacitors and methods that implement an internal electrode between at least two layers of pre-fired ceramic dielectric are also provided. Capacitors and methods that implement the integration of multiple dielectric types in a single device producing high frequency performance characteristics are also provided. Capacitors and dielectrics that implement the combination of a multi-layer capacitor with a thin single layer capacitor to further increase operating frequency and capacitance are also provided.

Abstract: Capacitors having form factors (e.g., dimensions and functionality) comparable with traditional single layer capacitors, but with considerably higher capacitance and methods of their manufacture are provided. Capacitors and methods that implement capacitors where at least one of the dielectric layers is reduced in thickness post firing to produce a device robust enough for automated handling and provide a stable surface for wire-bonding are also provided. Capacitors and methods that implement an internal electrode between at least two layers of pre-fired ceramic dielectric are also provided. Capacitors and methods that implement the integration of multiple dielectric types in a single device producing high frequency performance characteristics are also provided. Capacitors and dielectrics that implement the combination of a multi-layer capacitor with a thin single layer capacitor to further increase operating frequency and capacitance are also provided.

Abstract: A control assembly for manipulating the movement of an endoscopic instrument includes an endoscopic instrument mounting arrangement adapted to receive an endoscopic instrument, three driving arrangements, and three independent control elements. The mounting arrangement offers only three independent degrees of freedom of movement of an endoscopic instrument received by the arrangement, each degree of freedom of movement being about or along a respective axis. Each of the three driving arrangements are configured to drive the endoscopic instrument in only one of the degrees of freedom of movement. The three independent control elements are configured to receive user input, such that the actuation of each of the three independent control elements regulates one of three corresponding control signals, each control being a respective one of the driving arrangements independent of the other two driving arrangements in accordance with the user input.

Abstract: A high capacitance single layer ceramic capacitor having a ceramic dielectric body containing one or more internal electrodes electrically connected to a metallization layer applied to the side and a top or bottom surface and a metallization pad electrically isolated from the metallization side and the top or bottom surface by a castellation or a via or separated by a dielectric insulating band positioned between the electrodes around the perimeter of the ceramic body and separating the top and bottom surfaces.

Abstract: A multi-layer ceramic capacitor (MLCC) device includes a ceramic chip having electrically conductive layers embedded within the chip that form one or more capacitors connected by one or more vias to one or more upwardly facing wire-bondable pads on the top side of the device. One embodiment includes electrically conductive layers that form at least two stacked capacitors connected by vias to multiple upwardly facing wire-bondable pads on the top side, whereby the MLCC device has a reduced footprint while avoiding solder fillets. The wire-bondable pads may lie m a common plane or be pyramidally stepped. Metallization on the PCB-facing bottom side and at least one of the ends of the ceramic chip of another embodiment forms a downwardly facing capacitor terminal.

Abstract: A high capacitance single layer ceramic capacitor structure having a ceramic dielectric body containing one or more internal electrodes electrically connected to a metallization layer applied to the side and bottom surfaces and a metallization pad electrically isolated from the metallization side and bottom surfaces positioned on a top surface of the ceramic body.

Abstract: A multi-layer ceramic capacitor (MLCC) device includes a ceramic chip having electrically conductive layers embedded within the chip that form one or more capacitors connected by one or more vias to one or more upwardly facing wire-bondable pads on the top side of the device. One embodiment includes electrically conductive layers that form at least two stacked capacitors connected by vias to multiple upwardly facing wire-bondable pads on the top side, whereby the MLCC device has a reduced footprint while avoiding solder fillets. The wire-bondable pads may lie in a common plane or be pyramidally stepped. Metallization on the PCB-facing bottom side and at least one of the ends of the ceramic chip of another embodiment forms a downwardly facing capacitor terminal.

Abstract: A high capacitance single layer ceramic capacitor having a ceramic dielectric body containing one or more internal electrodes electrically connected to a metallization layer applied to the side and a top or bottom surface and a metallization pad electrically isolated from the metallization side and the top or bottom surface by a castellation or a via or separated by a dielectric insulating band positioned between the electrodes around the perimeter of the ceramic body and separating the top and bottom surfaces.

Abstract: A high capacitance single layer ceramic capacitor having a ceramic dielectric body containing one or more internal electrodes electrically connected to a metallization layer applied to the side and a top or bottom surface and a metallization pad electrically isolated from the metallization side and the top or bottom surface by a castellation or a via or separated by a dielectric insulating band positioned between the electrodes around the perimeter of the ceramic body and separating the top and bottom surfaces.

Abstract: A multi-layer ceramic capacitor (MLCC) device includes a ceramic chip having electrically conductive layers embedded within the chip that form one or more capacitors connected by one or more vias to one or more upwardly facing wire-bondable pads on the top side of the device. One embodiment includes electrically conductive layers that form at least two stacked capacitors connected by vias to multiple upwardly facing wire-bondable pads on the top side, whereby the MLCC device has a reduced footprint while avoiding solder fillets. The wire-bondable pads may lie in a common plane or be pyramidally stepped. Metallization on the PCB-facing bottom side and at least one of the ends of the ceramic chip of another embodiment forms a downwardly facing capacitor terminal.

Abstract: A high capacitance single layer ceramic capacitor structure having a ceramic dielectric body containing one or more internal electrodes electrically connected to a metallization layer applied to the side and bottom surfaces and a metallization pad electrically isolated from the metallization side and bottom surfaces positioned on a top surface of the ceramic body.

Abstract: A high capacitance single layer ceramic capacitor having a ceramic dielectric body containing one or more internal electrodes electrically connected to a metallization layer applied to the side and a top or bottom surface and a metallization pad electrically isolated from the metallization side and the top or bottom surface by a castellation or a via or separated by a dielectric insulating band positioned between the electrodes around the perimeter of the ceramic body and separating the top and bottom surfaces.

Abstract: A low-power consumption, talk-through system comprising: a headset worn by a user on his head, the headset further comprising: an array of at least 2 sets of 2 ambient sound microphones, each set positionable on each side of the head; a signal processing subsystem adapted to process respective electrical signals from the microphones and to provide respective outputs having acoustical source distance and intensity information; at least 4 acoustical output devices connectable to the signal processing subsystem, the respective acoustical output devices driven by the respective outputs of signal processing subsystem; and no on-board power source, wherein the user is provided with enhanced situational awareness and near human sound localization by the system.

Abstract: A device for supporting a patient, the device comprising first and second support members adapted to support respective first and second parts of a patient's body and being operable to move between a first configuration and a second configuration, wherein when a patient is supported by the device and the device is in the first configuration, the patient is in a first bodily position and is supported by the first support member, with little or none of the patient's weight being supported by the second support member, and when a patient is supported by the device and the device is in the second configuration, the patient is in a second bodily position and is supported by the second support member, with little or none of the patient's weight being supported by the first support member.

Abstract: A surgical tool support device includes an arm. The arm includes a flexible tubular main body; and a plurality of beads contained within the tubular main body. In a first configuration, a fluid at least partially surrounds the plurality of beads. In a second configuration, at least some of the fluid is evacuated such that the rigidity of the arm is increased.

Abstract: A surgical tool for use as an ablation device in a surgical operation including: an ablation module output configured to ablate a volume of material at a surgical site to form an ablated volume; a control module arranged to receive information indicative of the position of the surgical site; and a fluid output adapted to deliver fluid to the surgical site during a surgical operation such that at least part of the ablated volume is filled with fluid and the fluid is in direct contact with at least part of the surgical site. The control module is operable to control the flow rate of fluid delivered by the fluid output in response to the received information in order to control the position of the surgical site.

Abstract: A control assembly for manipulating the movement of an endoscopic instrument includes an endoscopic instrument mounting arrangement adapted to receive an endoscopic instrument, three driving arrangements, and three independent control elements. The mounting arrangement offers only three independent degrees of freedom of movement of an endoscopic instrument received by the arrangement, each degree of freedom of movement being about or along a respective axis. Each of the three driving arrangements are configured to drive the endoscopic instrument in only one of the degrees of freedom of movement. The three independent control elements are configured to receive user input, such that the actuation of each of the three independent control elements regulates one of three corresponding control signals, each control being a respective one of the driving arrangements independent of the other two driving arrangements in accordance with the user input.