Abstract: Aspects of the invention generally relate to a display sign heating apparatus, method of making and using the same and more particularly to a display sign for preventing or mitigating snow and icing from interfering with the display.

Abstract: Systems and methods for cooling a drive for downhole electric equipment such as an ESP, wherein the drive's electrical components are contained in one or more sealed enclosures to protect them from contaminants in external cooling air. In one embodiment, the drive has two sealed compartments that contain electrical components. Air internal to these compartments is circulated through air-to-air heat exchangers that are positioned in an adjacent duct. Alternating horizontal and vertical passageways through the heat exchangers are formed by flat plates that are offset from each other and connected alternately at their top/bottom and side edges. Air external to the sealed compartments is circulated through the duct to cool the heat exchangers. The amount of air circulated through each heat exchanger may be controlled by valves that regulate airflow through one or more outlets from the duct.

Abstract: Systems and methods for controlling potentially damaging inrushes of current to the capacitor bank of an electric drive system when the voltage on the capacitor bank is low. In one embodiment, a variable speed drive has a converter that converts AC power to DC power, a capacitor bank that receives the DC power, and an inverter that converts the DC power stored by the capacitor bank to AC output power. The converter has three sections that rectify the phases of three-phase input power. Each section has at least one controlled rectifier component, and the rectifier components have switches connected to them in parallel. When the voltage on the capacitor bank is low, the controlled rectifiers and switches are controlled to prevent dangerously high inrushes of current to the capacitor bank.

Abstract: Systems and methods for cooling a drive for downhole electric equipment such as an ESP, wherein the drive's electrical components are contained in one or more sealed enclosures to protect them from contaminants in external cooling air. In one embodiment, the drive has two sealed compartments that contain electrical components. Air internal to these compartments is circulated through air-to-air heat exchangers that are positioned in an adjacent duct. Alternating horizontal and vertical passageways through the heat exchangers are formed by flat plates that are offset from each other and connected alternately at their top/bottom and side edges. Air external to the sealed compartments is circulated through the duct to cool the heat exchangers. The amount of air circulated through each heat exchanger may be controlled by valves that regulate airflow through one or more outlets from the duct.

Abstract: Systems and methods for controlling potentially damaging inrushes of current to the capacitor bank of an electric drive system when the voltage on the capacitor bank is low. In one embodiment, a variable speed drive has a converter that converts AC power to DC power, a capacitor bank that receives the DC power, and an inverter that converts the DC power stored by the capacitor bank to AC output power. The converter has three sections that rectify the phases of three-phase input power. Each section has at least one controlled rectifier component, and the rectifier components have switches connected to them in parallel. When the voltage on the capacitor bank is low, the controlled rectifiers and switches are controlled to prevent dangerously high inrushes of current to the capacitor bank.

Abstract: A packaged array (10) having a temporary substrate (20) is used to test a plurality of semiconductor devices (14). In one embodiment, the temporary substrate (20) is an adhesive substrate, such as tape. A support structure (18) may lie over the temporary substrate (20) or be within the temporary substrate (20). The plurality of semiconductor devices (14) lie within an array (16, 6, or 8) and may be tested in parallel. One array or a multiple number of arrays may lie on the packaged array (10).

Abstract: A packaged array (10) having a temporary substrate (20) is used to test a plurality of semiconductor devices (14). In one embodiment, the temporary substrate (20) is an adhesive substrate, such as tape. A support structure (18) may lie over the temporary substrate (20) or be within the temporary substrate (20). The plurality of semiconductor devices (14) lie within an array (16, 6, or 8) and may be tested in parallel. One array or a multiple number of arrays may lie on the packaged array (10).