Abstract: An apparatus for forming metal tubes is shown in which a metal strip 2 is passed through the apparatus and is formed by a combination of rollers 17, 17', 19, and dies 15, 24 into a shape defining a tube. Prior to the completion of the formation of the metal strip 2 into a shape defining a tube, a brazing wire 1 is supplied through rollers 8 onto the metal strip 2 between two edge portions thereof to be bonded together. The edge portions are bonded together by means of a frictional wheel 27 rotating at high speed.

Abstract: An apparatus for forming metal tubes is shown in which a metal strip 2' having a brazing wire 1 bonded to an edge portion thereof passes through the apparatus and is formed by a combination of rollers 17, 17', 19, 19' and dies 15, 24 into a shape defining a tube. A frictional wheel 27 bonds together the two edge portions of the shape defining a tube.

Abstract: A machine for bonding connectors to the edge of a pcb by a Luc process has upper and lower wheels which are translated along the edge of the pcb for engaging the connectors to be applied respectively to the faces of the board. The relative position of the wheels at any given time is determined by mounting one of them to move with a jaw which closes down onto one of the faces.

Abstract: Bonds between a contact area of a circuit of a semiconductor and a conductor are formed by applying a rotating tool to an opposed surface of the conductor or to an intervening material superposed on it. The conductor may be laminated to one or more layers of insulant material and when that material is for example polyester, the bond may be formed without prior removal of the insulant from between the contact area and the conductor; it is displaced by the effect of the tool. The areas and conductors may be in an array and the tool be brought across the members of the array in succession.