Patents by Inventor Patrick Baginski

Patrick Baginski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor component and method of making the same
    Patent number: 8478559
    Abstract: One embodiment provides a semiconductor chip including a semiconductor body and a power semiconductor component integrated therein. The power semiconductor component includes a load electrode zone arranged on a first surface of the semiconductor body, a control electrode zone arranged on the first surface, the control electrode zone being electrically insulated from the load electrode zone, and a resistance track arranged on the load electrode zone and the control electrode zone. The resistance track ensures an electrical connection between the load electrode zone and the control electrode zone.
    Type: Grant
    Filed: March 19, 2012
    Date of Patent: July 2, 2013
    Assignee: Infineon Technologies AG
    Inventors: Patrick Baginski, Reinhold Bayerer, Holger Ruething, Daniel Domes
  • SEMICONDUCTOR COMPONENT AND METHOD OF MAKING THE SAME
    Publication number: 20120175780
    Abstract: One embodiment provides a semiconductor chip including a semiconductor body and a power semiconductor component integrated therein. The power semiconductor component includes a load electrode zone arranged on a first surface of the semiconductor body, a control electrode zone arranged on the first surface, the control electrode zone being electrically insulated from the load electrode zone, and a resistance track arranged on the load electrode zone and the control electrode zone. The resistance track ensures an electrical connection between the load electrode zone and the control electrode zone.
    Type: Application
    Filed: March 19, 2012
    Publication date: July 12, 2012
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Patrick Baginski, Reinhold Bayerer, Holger Ruething, Daniel Domes
  • Semiconductor component and method of determining temperature
    Patent number: 8155916
    Abstract: One embodiment provides a circuit arrangement integrated in a semiconductor body. At least one power semiconductor component integrated in the semiconductor body and having a control connection and a load connection is provided. A resistance component is thermally coupled to the power semiconductor component and likewise integrated into the semiconductor body and arranged between the control connection and the load connection of the power semiconductor component. The resistance component has a temperature-dependent resistance characteristic curve. A driving and evaluation unit is designed to evaluate the current through the resistance component or the voltage drop across the resistance component and provides a temperature signal dependent thereon.
    Type: Grant
    Filed: July 7, 2008
    Date of Patent: April 10, 2012
    Assignee: Infineon Technologies AG
    Inventors: Patrick Baginski, Reinhold Bayerer, Holger Ruething, Daniel Domes
  • Semiconductor circuit arrangement
    Patent number: 7708584
    Abstract: A semiconductor circuit arrangement is disclosed. In one embodiment, a semiconductor module is attached to a board using a screw, with a mechanical and electrical contact being made between module contacts on the semiconductor module and associated board contacts on the board at the same time by attachment using the screw.
    Type: Grant
    Filed: May 31, 2007
    Date of Patent: May 4, 2010
    Assignee: Infineon Technologies AG
    Inventors: Martin Hierholzer, Patrick Baginski, Michael Hornkamp, Uwe Jansen
  • SEMICONDUCTOR COMPONENT AND METHOD OF DETERMINING TEMPERATURE
    Publication number: 20100001785
    Abstract: One embodiment provides a circuit arrangement integrated in a semiconductor body. At least one power semiconductor component integrated in the semiconductor body and having a control connection and a load connection is provided. A resistance component is thermally coupled to the power semiconductor component and likewise integrated into the semiconductor body and arranged between the control connection and the load connection of the power semiconductor component. The resistance component has a temperature-dependent resistance characteristic curve. A driving and evaluation unit is designed to evaluate the current through the resistance component or the voltage drop across the resistance component and provides a temperature signal dependent thereon.
    Type: Application
    Filed: July 7, 2008
    Publication date: January 7, 2010
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Patrick Baginski, Reinhold Bayerer, Holger Ruething, Daniel Domes
  • SEMICONDUCTOR CIRCUIT ARRANGEMENT
    Publication number: 20070278669
    Abstract: A semiconductor circuit arrangement is disclosed. In one embodiment, a semiconductor module is attached to a board using a screw, with a mechanical and electrical contact being made between module contacts on the semiconductor module and associated board contacts on the board at the same time by attachment using the screw.
    Type: Application
    Filed: May 31, 2007
    Publication date: December 6, 2007
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Martin Hierholzer, Patrick Baginski, Michael Hornkamp, Uwe Jansen