Abstract: Embodiments include phased array antenna apparatus and methods of manufacturing them. In an embodiment, a phased array antenna apparatus includes at least one printed wiring board (PWB) (1002, FIG. 10) having multiple layers, at least one beamformer module (1014) with at least one beam combiner/divider, at least one amplifier (1016), and at least one integral radiating element (1006). The PWB includes RF manifolds (912, 916, FIG. 9) embedded within the multiple layers between corresponding ports (910, 914) of the beam combiners/dividers. The at least one integral radiating element is located proximate to an edge of the PWB and oriented in parallel with a bore-sight of the phased array antenna apparatus. In an embodiment, the beam combiners/dividers may include an H form combiner (704, FIG. 7). An opening (1026, FIG. 10) in the PWB is adapted to enable the amplifier to directly contact a heat sink (1004), in an embodiment.

Abstract: Embodiments include phased array antenna apparatus and methods of manufacturing them. In an embodiment, a phased array antenna apparatus includes at least one printed wiring board (PWB) (1002, FIG. 10) having multiple layers, at least one beamformer module (1014) with at least one beam combiner/divider, at least one amplifier (1016), and at least one integral radiating element (1006). The PWB includes RF manifolds (912, 916, FIG. 9) embedded within the multiple layers between corresponding ports (910, 914) of the beam combiners/dividers. The at least one integral radiating element is located proximate to an edge of the PWB and oriented in parallel with a bore-sight of the phased array antenna apparatus. In an embodiment, the beam combiners/dividers may include an H form combiner (704, FIG. 7). An opening (1026, FIG. 10) in the PWB is adapted to enable the amplifier to directly contact a heat sink (1004), in an embodiment.