Abstract: A method for separating a substrate of a brittle-hard material is provided. The method includes the steps of introducing defects into the substrate at a spacing from one another along a separation line using at least one pulsed laser beam; selecting an average spacing between neighboring defects and a number of laser pulses for generating a respective defect such that a breaking stress (?B) for separating the substrate along the separation line is smaller than a first reference stress (?R1) of the substrate and such that an edge strength ?K of the separation edge obtained after separation is greater than a second reference stress (?R2) of the substrate; and separating the substrate after introducing the defects by applying a stress along the separation line.

Abstract: A glass element includes a glass surface including a surface structuring with a structured region of the glass surface that, owing to glass removal, has a higher roughness than an adjoining unstructured region of the glass surface, the structured region having a mechanical stress profile which can be measured by stress birefringence. The structured region has a compressive stress on the glass surface that is higher in absolute terms than a stress in the adjoining unstructured region. At least one of the following is satisfied: the compressive stress becomes smaller in absolute terms with increasing depth and transitions into a tensile stress, a maximum tensile stress being smaller in absolute terms than the compressive stress on the glass surface; or the compressive stress has a value of less than 5 MPa in absolute terms on the glass surface and becomes smaller in absolute terms with increasing depth.

Abstract: A method for separating a substrate of a brittle-hard material is provided. The method includes the steps of introducing defects into the substrate at a spacing from one another along a separation line using at least one pulsed laser beam; selecting an average spacing between neighboring defects and a number of laser pulses for generating a respective defect such that a breaking stress (?B) for separating the substrate along the separation line is smaller than a first reference stress (?R1) of the substrate and such that an edge strength ?K of the separation edge obtained after separation is greater than a second reference stress (?R2) of the substrate; and separating the substrate after introducing the defects by applying a stress along the separation line.

Abstract: A method for separating a substrate of a brittle-hard material is provided. The method includes the steps of introducing defects into the substrate at a spacing from one another along a separation line using at least one pulsed laser beam; selecting an average spacing between neighboring defects and a number of laser pulses for generating a respective defect such that a breaking stress (?B) for separating the substrate along the separation line is smaller than a first reference stress (?R1) of the substrate and such that an edge strength ?K of the separation edge obtained after separation is greater than a second reference stress (?R2) of the substrate; and separating the substrate after introducing the defects by applying a stress along the separation line.

Abstract: A flat glass is provided that includes a first side face, an opposite, second side face, and at least one edge face. The flat glass has a linear predetermined breaking location on the first or second side face. The flat glass also has two mutually separated points, where at least one of the two mutually separated points lies on the linear predetermined breaking location. The two mutually separated points are each configured as a point of attack for a force for breaking the flat glass. The two mutually separated points have breaking forces required to break the flat glass that differ from one another in magnitude and/or direction.

Abstract: A method for separating a substrate of a brittle-hard material is provided. The method includes the steps of introducing defects into the substrate at a spacing from one another along a separation line using at least one pulsed laser beam; selecting an average spacing between neighboring defects and a number of laser pulses for generating a respective defect such that a breaking stress (?B) for separating the substrate along the separation line is smaller than a first reference stress (?R1) of the substrate and such that an edge strength ?K of the separation edge obtained after separation is greater than a second reference stress (?R2) of the substrate; and separating the substrate after introducing the defects by applying a stress along the separation line.