Abstract: Refrigerant comprising from about 15% to about 22% by weight of R-32; from about 61% to about 71.5% by weight of HF0-1234yf; from about 4% to about 14.5% by weight of HFO-1132(E); and from 1% to 4% by weight of CO2.

Abstract: Refrigerant comprising from more than 84% to less than 91% by weight of HFO-1234yf; from more than 7% to less than 15% by weight of HFO-1132(E); and from more than 1% to 2.5% by weight of CO2.

Abstract: The AHU includes an air dehumidifying (AD) flow path, an air regeneration (AR) flow path, a first desiccant wheel and a second desiccant wheel each in the AD flow path and the AR flow path, a first cooler heat exchanger in the AD flow path, a second cooler in the AD flow path, and a heater disposed in the AR flow path. An HVACR system includes the AHU and a chiller configured to supply chiller liquid to the first cooler heat exchanger and the second cooler heat exchanger in the AHU. A method of conditioning air in an HVACR system includes directing air through the air dehumidifying (AD) flow path and directing air through an air regeneration (AR) flow path to regenerate the desiccant in a first desiccant wheel and the desiccant in a second desiccant wheel.

Abstract: A cooling system includes a container having a water-based fluid in which are immersed printed circuit boards (PCBs). One or more high-thermal electrical components are disposed on the PCBs. A condenser causes water vapor generated by the one or more high-thermal electrical components to condense and passively return to the water-based fluid. A nano-engineered coating is deposited over the one or more high-thermal electrical components that includes an electrical insulation coating of between two to 25 microns in thickness deposited on the one or more high-thermal electrical components. A metallic nano-layer comprising a porous metallic nano-structure deposited on the electrical insulation coating.

Abstract: A method includes coating, via chemical vapor deposition, electronics disposed on a printed circuit board (PCB) with an electrical insulation coating of between one micron to 25 microns. The method further include depositing, on the electrical insulation coating, a metallic nano-layer comprising a porous metallic nano-structure. The method further includes, after the coating and the depositing, immersing the PCB in a water-based fluid to cool the electronics while the electronics are powered on.