Abstract: A substrate processing chamber is provided. The substrate processing chamber including a substrate support, a radiation module, a support system, and a window. The substrate support is disposed in a processing volume of the processing chamber. The radiation module is configured to generate and emit a beam of radiation including a wavelength within a range of about 750 nanometers (nm) to about 3000 nm. The support system is configured to support a radiation emitting end portion of the radiation module such that the beam of radiation is emitted at an incidence angle towards the substrate support, wherein the incidence angle of incidence is in a range of about 15° to about 70° from a vertical axis and move the radiation emitting end portion to scan an upper surface of a substrate with the beam of radiation. The window positioned between the radiation module and the substrate support.

Abstract: An apparatus for heating a substrate within a thermal processing chamber is disclosed. The apparatus includes a chamber body, a gas inlet, a gas outlet, an upper window, a lower window, a substrate support, and an upper heating device. The upper heating device is a laser heating device and includes one or more laser assemblies. The laser assemblies include light sources, a cooling plate, optical fibers, and irradiation windows.

Abstract: An apparatus for heating a substrate within a thermal processing chamber is disclosed. The apparatus includes a chamber body, a gas inlet, a gas outlet, an upper window, a lower window, a substrate support, and an upper heating device. The upper heating device is a laser heating device and includes one or more laser assemblies. The laser assemblies include light sources, a cooling plate, optical fibers, and irradiation windows.

Abstract: An apparatus for heating a substrate within a thermal processing chamber is disclosed. The apparatus includes a chamber body, a gas inlet, a gas outlet, an upper window, a lower window, a substrate support, and an upper heating device. The upper heating device is a laser heating device and includes one or more laser assemblies. The laser assemblies include light sources, a cooling plate, optical fibers, and irradiation windows.

Abstract: Method and system for laser crystal degradation compensation are disclosed. The method includes: defining a plurality of sites on a frequency converting crystal; determining a degradation rate associated with each of the plurality of sites; determining an amount of time T wherein a site is continuously operable within a tolerated variation of at least one beam parameter, the amount of time T being determined based on the tolerated variation of the at least one beam parameter and the degradation rate; determining an amount of time t wherein t is a fraction of T; and iteratively shifting among the plurality of sites, wherein each of the plurality of sites is utilized continuously for a duration of time t for each iteration.

Abstract: Method and system for laser crystal degradation compensation are disclosed. The method includes: defining a plurality of sites on a frequency converting crystal; determining a degradation rate associated with each of the plurality of sites; determining an amount of time T wherein a site is continuously operable within a tolerated variation of at least one beam parameter, the amount of time T being determined based on the tolerated variation of the at least one beam parameter and the degradation rate; determining an amount of time t wherein t is a fraction of T; and iteratively shifting among the plurality of sites, wherein each of the plurality of sites is utilized continuously for a duration of time t for each iteration.