Abstract: The process for mounting an integrated circuit (11) on a support (10) comprising a structure (13) of conductors (14) comprises connecting the conductors to respective terminals (12) of the integrated circuit without interposing a part of the support for insulating the conductors of the integrated circuit as in the standard TAB technology. The connection can be made directly by thermocompression or ultrasound, or indirectly through ball bonds. It is only after the connection that the insulation between the conductors and the integrated circuit is applied. The insulating substrate of the TAB support (10) can be attached to the conductors outside the integrated circuit, before or after the connection of the conductors.

Abstract: A device for cambering conductive fingers, including a cambering plate (14) having a mold (16) which corresponds to the camber to be produced, a device for positioning (8) the intermediate substrate relative to the cambering plate (14), a cambering tool (22) disposed opposite the mold (16) for acting on a conductive finger (4), and a control device (24, 7) for ensuring or controlling the relative displacement of the cambering plate and the cambering tool in a first direction perpendicular to the plane containing the conductive fingers (4) and in a second direction parallel to the longitudinal direction of the conductive fingers (4).

Abstract: A method of fabricating a carrier support for integrated circuit chips to be mounted subsequently on a substrate. A flexible strip of an inextensible insulating material is provided with equidistant openings in the center of each of which a chip is to be mounted. One of the faces of this strip is covered with a conductive film, the said film is cut away to form in each opening interface conductors which overhang towards the center of the opening. Before the conductive film is cut away, the film is coated with a layer of photosensitive lacquer which is partly removed to enable the film to be laid bare in regions which, in each opening, form part of an open-centered zone which surrounds that portion of the film in which the free inner ends of the interface conductors associated with this opening are to be produced.