Patents by Inventor Patrick D. Sheahen

Patrick D. Sheahen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6821368
    Abstract: A method is provided for using a woven preform having a base and at least one leg extending from the base. The preform is used to assemble first and second composite laminate components formed from tape or fabric and a resin matrix. Z-pins are inserted into the first component prior to its being cured, forming a stubble extending above a surface of the first component. The uncured preform is placed on the surface of the first component, the stubble extending into the preform. The cured second component is attached to the preform. Over-wrap plies are optionally placed on the outer surfaces of preform. Adhesive is optionally placed between the preform and the first and second components. A vacuum bag and tooling are used while curing the preform to adhere the legs of the preform to the second component and the base of the preform to the first component.
    Type: Grant
    Filed: October 9, 2001
    Date of Patent: November 23, 2004
    Assignee: Lockheed Martin Corporation
    Inventors: Ross A. Benson, Patrick D. Sheahen, Larry R. Bersuch
  • Publication number: 20040023581
    Abstract: A method uses a three-dimensional, adhesive-infused, woven preform to assemble two components, each component having z-pins extending from bonding surfaces. The components and preform are assembled with surfaces of the preform contacting surfaces of the components, the z-pins penetrating into the preform. The adhesive in the preform is then cured, adhering the preform to the components and retaining the z-pins within the preform. The adhesive may be cured at room temperature or through heat applied to the outer component. Alternatively, an electron-beam may be used to cure the adhesive. Use of z-pins in the bond area and an adhesive, instead of a resin, creates a stronger joint, especially with fiber-reinforcement of the adhesive. The thickness of the compressible, three-dimensional weave provides for a larger dimensional tolerance at each bond line.
    Type: Application
    Filed: August 5, 2002
    Publication date: February 5, 2004
    Inventors: Larry R. Bersuch, Patrick D. Sheahen
  • Publication number: 20030116267
    Abstract: A method uses a three-dimensional, woven preform to assemble two components, the preform having at least a pair of legs extending from a base. The woven preform is infused with a resin, and at least one surface of one of the components is bonded to the legs of the preform using the resin within the preform. The other of the components is then attached to the preform by adhering the component with the resin in the preform. The preform is squeegeed into place, ensuring that air pockets are eliminated and a continuous bond line is created. Resin systems providing for oven or room-temperature curing may be used.
    Type: Application
    Filed: December 21, 2001
    Publication date: June 26, 2003
    Inventors: Patrick D. Sheahen, Ronald P. Schmidt
  • Publication number: 20030066589
    Abstract: A method is provided for using a woven preform having a base and at least one leg extending from the base. The preform is used to assemble first and second composite laminate components formed from tape or fabric and a resin matrix. Z-pins are inserted into the first component prior to its being cured, forming a stubble extending above a surface of the first component. The uncured preform is placed on the surface of the first component, the stubble extending into the preform. The cured second component is attached to the preform. Over-wrap plies are optionally placed on the outer surfaces of preform. Adhesive is optionally placed between the preform and the first and second components. A vacuum bag and tooling are used while curing the preform to adhere the legs of the preform to the second component and the base of the preform to the first component.
    Type: Application
    Filed: October 9, 2001
    Publication date: April 10, 2003
    Inventors: Ross A. Benson, Patrick D. Sheahen, Larry R. Bersuch
  • Publication number: 20030041948
    Abstract: A method is provided for securing a three-dimensional woven preform to a first composite laminate component, the preform having a base and at least one leg extending from the base. The preform may be used to attach a second component or may be used alone to stiffen the first component. The preform and the first component are uncured, whereas the second component is cured prior to assembly. The preform is positioned on the first component, adhesive optionally being located between the preform and the first component. Z-pins are driven through the base of the preform and into the first component, the pins extending into the base and the first component. The second component is attached to the leg of the preform. A vacuum bag and tooling are used while curing the first component and the preform and the preform to the first component. The second component may be bonded or fastened to the preform.
    Type: Application
    Filed: August 31, 2001
    Publication date: March 6, 2003
    Inventors: Larry R. Bersuch, Ross A. Benson, Patrick D. Sheahen, Charles M. Rodenberger