Abstract: An optical semiconductor device may include a semiconductor component having an optical sensor on a front face thereof, and a transparent plate having electrical connection lines on a rear face thereof and lying outside a free region of the rear face. The front face of the semiconductor component may be attached to the rear face of the transparent plate so that the optical sensor is adjacent the free region. The optical semiconductor device may also include electrical connectors electrically connecting the semiconductor component to the electrical connection lines, a sealing spacer extending only partway between the front face of the semiconductor component and the rear face of the transparent plate at the periphery of the optical sensor, and an encapsulating material for encapsulating the electrical connectors and a periphery of the semiconductor component on the rear face of the transparent plate. The sealing spacer may be structurally distinct from, abutting, and retaining the encapsulating material.

Abstract: Optical semiconductor package and its method of fabrication, which package comprises a semiconductor component (6), a rear face of which is attached to a front face of a mounting and electrical connection support (2) and a front face of which comprises an optical sensor (9), means (11) for electrically connecting the semiconductor component to the support, a transparent chip (12) placed in front of the semiconductor component, which lies at least in front of the optical sensor, and encapsulation means (21) comprising an encapsulation material which envelopes, in front of the support, the periphery of the semiconductor component and of the chip, without covering at least the central part of the front face of this chip.

Abstract: Optical semiconductor device, characterized in that it comprises a semiconductor component (2), one front face of which has an optical sensor (3), a transparent plate (6), a rear face of which has electrical connection tracks or lines (8), attachment means (5,10,11) in order to attach the front face of the said semiconductor component to the rear face of the said transparent plate, electrical connection means (5) in order to electrically connect the said semiconductor component to the said electrical connection lines, and encapsulation means comprising a material for encapsulating the said connection means (5) and the periphery of the said semiconductor component (2) on the rear face of the said transparent plate (6), so as to form a peripheral sealing ring (11) between the said semiconductor component and the rear face of the said transparent plate, the said electrical connection lines (8) lying under the said sealing ring and outside the latter.