Patents by Inventor Patrick David Smith

Patrick David Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for increasing heat transfer that is restricted in thermally isolated pockets of a medium
    Patent number: 6173883
    Abstract: A thermal mass (18) is reflow soldered atop of a multi-layered medium (10) in order to yield minimum thermal resistance between a heat source (22) located on the multi-layered medium (10) and the thermal mass (18) for greater heat dissipation efficiency. Moreover, the thermal mass (18) can be auto-placed onto the multi-layered medium (10) in order to accurately and closely position the thermal mass (18) next to the heat source (22).
    Type: Grant
    Filed: November 17, 1998
    Date of Patent: January 16, 2001
    Assignee: Motorola, Inc.
    Inventors: Harold Joseph Gorenz, Jr., Patrick David Smith, Jeffrey P. Hasler