Patents by Inventor Patrick De Marcillac

Patrick De Marcillac has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hybrid part-accessory connections
    Patent number: 11904535
    Abstract: A hybrid connection for connecting a first portion of a three-dimensional (3D) print design to a second portion of the 3D print design may include a cross-sectional pattern of fully-fused connections and under-fused connections that connect between the first portion of the 3D print design and the second portion of the 3D print design. Systems and methods are also described herein that facilitate designing 3D parts with hybrid connections and/or automatically replacing fully-fused connections with hybrid connections.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: February 20, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Wei Huang, Patrick De Marcillac, Gary J. Dispoto
  • Storage enclosures
    Patent number: 11699317
    Abstract: In one example, a physical storage enclosure can include a storage area to enclose a device, a locking mechanism to prevent removal of the device from the storage area, a logical configuration system coupled to the device within the storage area, wherein the logical configuration system includes instructions to identify the device within the storage area and alter instructions associated with the device within the storage area, a hardware logistic system coupled to the locking mechanism to activate and deactivate the locking mechanism, and a firewall to restrict communication between the logical configuration system and the hardware logistic system.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: July 11, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Patrick De Marcillac, Sandro Secci, Samir Bouraoui
  • Storage enclosures
    Patent number: 11636722
    Abstract: In one example, a physical storage enclosure can include a storage area to enclose a device, a locking mechanism to prevent removal of the device from the storage area, a logical configuration system coupled to the device within the storage area, wherein the logical configuration system includes instructions to identify the device within the storage area and alter instructions associated with the device within the storage area, a hardware logistic system coupled to the locking mechanism to activate and deactivate the locking mechanism, and a firewall to restrict communication between the logical configuration system and the hardware logistic system.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: April 25, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Patrick De Marcillac, Sandro Secci, Samir Bouraoui
  • STORAGE ENCLOSURES
    Publication number: 20220172538
    Abstract: In one example, a physical storage enclosure can include a storage area to enclose a device, a locking mechanism to prevent removal of the device from the storage area, a logical configuration system coupled to the device within the storage area, wherein the logical configuration system includes instructions to identify the device within the storage area and alter instructions associated with the device within the storage area, a hardware logistic system coupled to the locking mechanism to activate and deactivate the locking mechanism, and a firewall to restrict communication between the logical configuration system and the hardware logistic system.
    Type: Application
    Filed: July 26, 2019
    Publication date: June 2, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Patrick De Marcillac, Sandro Secci, Samir Bouraoui
  • HYBRID PART-ACCESSORY CONNECTIONS
    Publication number: 20220072770
    Abstract: A hybrid connection for connecting a first portion of a three-dimensional (3D) print design to a second portion of the 3D print design may include a cross-sectional pattern of fully-fused connections and under-fused connections that connect between the first portion of the 3D print design and the second portion of the 3D print design. Systems and methods are also described herein that facilitate designing 3D parts with hybrid connections and/or automatically replacing fully-fused connections with hybrid connections.
    Type: Application
    Filed: May 13, 2020
    Publication date: March 10, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Wei Huang, Patrick De Marcillac, Gary J. Dispoto