Abstract: A DC voltage converter of the quasi-resonant Buck type includes an input port having a first terminal designed to receive a voltage level to be converted, an output port having a first terminal designed to supply a converted voltage level, a first switch connected in series to the first terminal of the input port and a regulation circuit configured for: generating a ripple voltage, rising or falling depending on a closed or open state of the first switch; generating a setpoint signal proportional to a difference between an average level of converted voltage and a reference voltage; performing a first comparison between the setpoint signal and the converted voltage level to which the ripple voltage has been added; and depending on the result of the first comparison, generating or not an activation signal on its output controlling the closing of the first switch for a predefined period.

Abstract: A DC voltage converter of the quasi-resonant Buck type includes an input port having a first terminal designed to receive a voltage level to be converted, an output port having a first terminal designed to supply a converted voltage level, a first switch connected in series to the first terminal of the input port and a regulation circuit configured for: generating a ripple voltage, rising or falling depending on a closed or open state of the first switch; generating a setpoint signal proportional to a difference between an average level of converted voltage and a reference voltage; performing a first comparison between the setpoint signal and the converted voltage level to which the ripple voltage has been added; and depending on the result of the first comparison, generating or not an activation signal on its output controlling the closing of the first switch for a predefined period.

Abstract: A method for controlling a multiphase resonant DC/DC converter comprising a plurality of identical elementary resonant DC/DC converters connected in parallel. The method comprises the steps of measuring each of the supply currents (IR1, IR2, . . . IRn) of the elementary converters for balancing the supply currents (IR1, IR2, . . . IRn) and controlling switching frequencies (F1, F2, . . . Fn) of the elementary converters according to the supply currents (IR1, IR2, . . . IRn), so as to carry out the balancing. The supply currents (IR1, IR2, . . . IRn) are measured in the elementary DC/DC converters in order to balance these same currents.

Abstract: The control method according to the invention concerns a multiphase resonant DC/DC converter comprising a plurality of identical elementary DC/DC converters connected in parallel. Supply currents (IR1, IR2, . . . IRn) are measured in the elementary DC/DC converters in order to balance these same currents. According to the method, switching frequencies of the elementary DC/DC converters are controlled on the basis of the supply currents in such a way as to achieve the balance. Another feature involves setting the supply currents to a common reference intensity (Iref) determined on the basis of a difference between an output voltage (Vo) of the multiphase converter and a nominal voltage (Vref).

Abstract: The invention relates to a power module (10), preferably for a vehicle, in particular an electric vehicle, characterized in that said module includes two vertically adjacent semiconducting chips (12, 14), each chip having a first surface (20, 22) to be connected to a heat sink substrate (24, 26), and a second surface (28, 30) separate from the first and on which at least one electronic component (38a-44b) is arranged, the module being arranged such that the second surfaces of the chips are arranged opposite one another.

Abstract: The invention relates to a power module (10), preferably for a vehicle, in particular an electric vehicle, characterised in that said module includes two vertically adjacent semiconducting chips (12, 14), each chip having a first surface (20, 22) to be connected to a heat sink substrate (24, 26), and a second surface (28, 30) separate from the first and on which at least one electronic component (38a-44b) is arranged, the module being arranged such that the second surfaces of the chips are arranged opposite one another.