Abstract: The present invention relates to inhibitors of p38, a mammalian protein kinase involved cell proliferation, cell death and response to extracellular stimuli. The invention also relates to methods for producing these inhibitors. The invention also provides pharmaceutical compositions comprising the inhibitors of the invention and methods of utilizing those compositions in the treatment and prevention of various disorders.

Abstract: The present invention relates to inhibitors of p38, a mammalian protein kinase involved cell proliferation, cell death and response to extracellular stimuli. The compounds are of the class of pyrido [1,2-c] pyrimidin-3-one or 1,2-dihydro-pyrido [1,2-c] pyrimidin-3-one derivatives, useful as inhibitors of p38. The invention also relates to methods for producing these inhibitors. The invention also provides pharmaceutical compositions comprising the inhibitors of the invention and methods of utilizing those compositions in the treatment and prevention of various disorders.

Abstract: A chip carrier for wire bond-type chips is disclosed. This chip carrier employs organic dielectric materials, rather than ceramic materials, as is conventional. This chip carrier also employs at least one organic, photoimageable dielectric layer, having plated photo-vias, to electrically interconnect two (or more) layers of fan-out circuitry. This chip carrier further employs a single-tiered cavity to contain a chip, rather than a multi-tiered cavity, as is conventional. Moreover, this chip carrier includes thermal via holes and/or a metallic layer, directly beneath the chip, to enhance heat dissipation.

Abstract: The present invention relates to inhibitors of p38, a mammalian protein kinase involved cell proliferation, cell death and response to extracellular stimuli. The invention also relates to methods for producing these inhibitors. The invention also provides pharmaceutical compositions comprising the inhibitors of the invention and methods of utilizing those compositions in the treatment and prevention of various disorders.

Abstract: The keypad is made of a) a formed plastic shell; b) graphics and background printed on the interior surface of the formed plastic shell; and c) a plastic filling the hollow cavity or cavities of the formed plastic shell. The formed plastic shell of the keypad is a polycarbonate and the plastic filling the hollow cavities is a thermoplastic resin or an elastomer. Additionally, the background printed on the interior surface of the formed plastic shell is made with a flexible ink and the keypad has a wear resistance test score in a Norman tester of greater than 40 cycles before the ink on the keypad fails on abrasion testing.

Abstract: A modular structure for providing electrical interconnections achieves greatly increased wiring density by forming vias and wiring patterns by chemical (e.g. lithographic) processes rather than by mechanical processes such as punching of vias and screening patterns of conductive paste. A basic module is a power core comprising an apertured metallic foil with an insulator applied to surfaces thereof, extending through at least one aperture and exposing the metallic foil in at least one aperture. The foil in the power core provides stiffness to facilitate subsequent handling and electrical shielding between conductive layers as well as a potential power connection. Via connections of increased conductivity and robustness are formed by plating the interior of vias after lamination of a desired combination of power cores and signal cores.

Abstract: A process for making a circuitized substrate is defined wherein the substrate is treated with two different, e.g., additive and subtractive, metallization processes. The process is thus able to effectively produce substrates including conductive features, e. g., high density circuit lines and chip heat-sinking pads, of two different degrees of resolution in a cost effective and expeditious manner. The resulting product is also defined.

Abstract: A chip carrier for wire bond-type chips is disclosed. This chip carrier employs organic dielectric materials, rather than ceramic materials, as is conventional. This chip carrier also employs at least one organic, photoimageable dielectric layer, having plated photo-vias, to electrically interconnect two (or more) layers of fan-out circuitry. This chip carrier further employs a single-tiered cavity to contain a chip, rather than a multi-tiered cavity, as is conventional. Moreover, this chip carrier includes thermal via holes and/or a metallic layer, directly beneath the chip, to enhance heat dissipation.

Abstract: The present invention provides a method of ablative photodecomposition and forming metal pattern which attains high resolution, is convenient, and employs non-halogenated solvents. The present invention is directed to a process for forming a metal pattern, preferably circuitization on an organic substrate, preferably on a circuit board or component thereof, which comprises coating the substrate with an ablatively-removable coating comprising a polymer resin preferably an acrylate polymer resin and preferably an ultraviolet absorber. A pattern is formed in the polymer coating corresponding to the desired metal pattern by irradiating at least a portion of the polymer coating with a sufficient amount of ultraviolet radiation to thereby ablatively remove the irradiated portion of the polymer coating. Next the patterned substrate is coated with a conductive metal paste to define the metal pattern, and the conductive metal paste is cured.

Abstract: A chip carrier for wire bond-type chips is disclosed. This chip carrier employs organic dielectric materials, rather than ceramic materials, as is conventional. This chip carrier also employs at least one organic, photoimageable dielectric layer, having plated photo-vias, to electrically interconnect two (or more) layers of fan-out circuitry. This chip carrier further employs a single-tiered cavity to contain a chip, rather than a multi-tiered cavity, as is conventional. Moreover, this chip carrier includes thermal via holes and/or a metallic layer, directly beneath the chip, to enhance heat dissipation.

Abstract: A process for making a circuitized substrate is defined wherein the substrate is treated with two different, e.g., additive and subtractive, metallization processes. The process is thus able to effectively produce substrates including conductive features, e.g., high density circuit lines and chip heat-sinking pads, of two different degrees of resolution in a cost effective and expeditious manner. The resulting product is also defined.

Abstract: A recycling game apparatus includes a toy vehicle having a plurality of bins for holding game pieces and having a card caddy thereon. A deck of cards is supported in the toy vehicle card caddy along with a plurality of game pieces with each game piece having a shaped emulative of a recycling member and stored in a marked bin. The game pieces can be moved into and out of the bins in playing the game. Each card in the deck of cards has information concerning one recycling item which is emulative of at least one game piece, such as aluminum, newspaper, glass, or plastic. Each toy vehicle plurality of bins may be marked with indicia to indicate aluminum, paper, glass, plastic, or trash. The toy vehicle is used to store the game with cards and pieces as well as used in playing the game.