Patents by Inventor Patrick Dunaway

Patrick Dunaway has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compliant interconnects for semiconductors and micromachines
    Patent number: 7378742
    Abstract: A compliant interconnect is described that is useful for coupling semiconductor dies to other components. In one embodiment, the interconnect includes a base to couple to a first component and an arch extending from and integral with the base to couple to a second component. The interconnect may be formed by coating a substrate with photoresist, exposing the photoresist with a defined pattern, developing the photoresist, baking the photoresist at a first temperature for a first amount of time to reflow the photoresist, and baking the photoresist at a second higher temperature for a second amount of time to reflow the photoresist.
    Type: Grant
    Filed: October 27, 2004
    Date of Patent: May 27, 2008
    Assignee: Intel Corporation
    Inventors: Sriram Muthukumar, Charles D. Hill, Chandrasekhar Ramaswamy, Patrick Dunaway
  • Process for coating thick resist over polymer features
    Publication number: 20060286487
    Abstract: An embodiment of a process is disclosed comprising depositing a sealing layer on a first photoresist layer formed on a substrate, the first photoresist layer having a form patterned and etched therein, depositing a second photoresist layer on the sealing layer, and curing the second photoresist layer by changing its temperature from a first temperature to a second temperature over a set period of time. An embodiment of an apparatus is disclosed comprising a substrate having a first photoresist layer thereon, the first photoresist layer having a form patterned and etched therein, a sealing layer deposited on the first photoresist layer, and a second photoresist layer on the sealing layer, wherein the second photoresist layer is cured by changing its temperature from a first temperature to a second temperature over a set period of time. Other embodiments are disclosed and claimed.
    Type: Application
    Filed: June 20, 2005
    Publication date: December 21, 2006
    Inventors: Charles Hill, Sriram Muthukumar, Patrick Dunaway
  • Compliant interconnects for semiconductors and micromachines
    Publication number: 20060087032
    Abstract: A compliant interconnect is described that is useful for coupling semiconductor dies to other components. In one embodiment, the interconnect includes a base to couple to a first component and an arch extending from and integral with the base to couple to a second component. The interconnect may be formed by coating a substrate with photoresist, exposing the photoresist with a defined pattern, developing the photoresist, baking the photoresist at a first temperature for a first amount of time to reflow the photoresist, and baking the photoresist at a second higher temperature for a second amount of time to reflow the photoresist.
    Type: Application
    Filed: October 27, 2004
    Publication date: April 27, 2006
    Inventors: Sriram Muthukumar, Charles Hill, Chandrashekhar Ramaswamy, Patrick Dunaway