Patents by Inventor Patrick Eckhout

Patrick Eckhout has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9869044
    Abstract: A method of applying stitching to an interior component is provided herein. The interior component having only a single layer of a substrate layer. The method including the steps of: a) penetrating substrate layer with an awl of a sewing head to form a piercing therethrough; b) retracting the awl from the substrate layer; c) inserting a needle of the same sewing head through the piercing through the substrate layer to grasp a thread positioned on a show surface of the outer skin layer; d) pulling the thread through the substrate layer; e) looping the thread with a previous stitch passed through the substrate layer; f) advancing the sewing head to another position with respect to the interior component, wherein a backside of the substrate layer is free of obstructions; and g) repeating steps a-f until a predetermined amount of stitches are applied to the interior component.
    Type: Grant
    Filed: October 22, 2015
    Date of Patent: January 16, 2018
    Assignee: INTEVA PRODUCTS, LLC
    Inventors: Edward J. Wenzel, Ramez M. Habhab, Patrick Eckhout
  • Patent number: 9790627
    Abstract: A method of applying stitching to an interior component is provided herein. The interior component having only a single layer of a substrate layer. The method including the steps of: a) penetrating substrate layer with an awl to form a piercing therethrough; b) retracting the awl from the substrate layer; c) inserting a needle of a sewing head through the piercing through the substrate layer to grasp a thread positioned on a show surface of the outer skin layer; d) pulling the thread through the substrate layer; e) looping the thread with a previous stitch passed through the substrate layer; f) advancing the sewing head to another position with respect to the interior component, wherein a backside of the substrate layer is free of obstructions; and g) repeating steps a-f until a predetermined amount of stitches are applied to the interior component.
    Type: Grant
    Filed: May 16, 2016
    Date of Patent: October 17, 2017
    Assignee: INTEVA PRODUCTS, LLC
    Inventors: Edward J. Wenzel, Ramez Habhab, Patrick Eckhout
  • Publication number: 20160369440
    Abstract: A method of applying stitching to an interior component is provided herein. The interior component having only a single layer of a substrate layer. The method including the steps of: a) penetrating substrate layer with an awl to form a piercing therethrough; b) retracting the awl from the substrate layer; c) inserting a needle of a sewing head through the piercing through the substrate layer to grasp a thread positioned on a show surface of the outer skin layer; d) pulling the thread through the substrate layer; e) looping the thread with a previous stitch passed through the substrate layer; f) advancing the sewing head to another position with respect to the interior component, wherein a backside of the substrate layer is free of obstructions; and g) repeating steps a-f until a predetermined amount of stitches are applied to the interior component.
    Type: Application
    Filed: May 16, 2016
    Publication date: December 22, 2016
    Inventors: Edward J. Wenzel, Ramez Habhab, Patrick Eckhout
  • Patent number: 9340912
    Abstract: A method of applying stitching to an interior component is provided herein. The interior component having only a single layer of a substrate layer. The method including the steps of: a) penetrating substrate layer with an awl to form a piercing therethrough; b) retracting the awl from the substrate layer; c) inserting a needle of a robotic sewing head through the piercing through the substrate layer to grasp a thread positioned on a show surface of the outer skin layer; d) pulling the thread through the substrate layer; e) looping the thread with a previous stitch passed through the substrate layer; f) advancing the robotic sewing head to another position with respect to the interior component, wherein a backside of the substrate layer is free of obstructions; and g) repeating steps a-f until a predetermined amount of stitches are applied to the interior component.
    Type: Grant
    Filed: October 22, 2014
    Date of Patent: May 17, 2016
    Assignee: INTEVA PRODUCTS, LLC
    Inventors: Edward J. Wenzel, Ramez Habhab, Patrick Eckhout
  • Publication number: 20160122928
    Abstract: A method of applying stitching to an interior component is provided herein. The interior component having only a single layer of a substrate layer. The method including the steps of: a) penetrating substrate layer with an awl of a sewing head to form a piercing therethrough; b) retracting the awl from the substrate layer; c) inserting a needle of the same sewing head through the piercing through the substrate layer to grasp a thread positioned on a show surface of the outer skin layer; d) pulling the thread through the substrate layer; e) looping the thread with a previous stitch passed through the substrate layer; f) advancing the sewing head to another position with respect to the interior component, wherein a backside of the substrate layer is free of obstructions; and g) repeating steps a-f until a predetermined amount of stitches are applied to the interior component.
    Type: Application
    Filed: October 22, 2015
    Publication date: May 5, 2016
    Inventors: Edward J. Wenzel, Ramez M. Habhab, Patrick Eckhout
  • Publication number: 20150042117
    Abstract: A method of applying stitching to an interior component is provided herein. The interior component having only a single layer of a substrate layer. The method including the steps of: a) penetrating substrate layer with an awl to form a piercing therethrough; b) retracting the awl from the substrate layer; c) inserting a needle of a robotic sewing head through the piercing through the substrate layer to grasp a thread positioned on a show surface of the outer skin layer; d) pulling the thread through the substrate layer; e) looping the thread with a previous stitch passed through the substrate layer; f) advancing the robotic sewing head to another position with respect to the interior component, wherein a backside of the substrate layer is free of obstructions; and g) repeating steps a-f until a predetermined amount of stitches are applied to the interior component.
    Type: Application
    Filed: October 22, 2014
    Publication date: February 12, 2015
    Inventors: Edward J. Wenzel, Ramez M. Habhab, Patrick Eckhout