Abstract: The invention describes a method and apparatus for deploying micromachined actuators in a plane which is orthogonal to the original fabrication plane of the devices. Using batch-processing, photolithographic procedures known in the micromachined electro-mechanical system (MEMS) art, a plurality of devices is constructed on a suitable substrate. The devices are then separated one from another by sawing and dicing the original fabrication wafer. The devices are rotated into an orthogonal orientation and affixed to a second wafer. The second wafer also contains circuitry for addressing and manipulating each of the devices independently of the others. With this method and apparatus, arrays of actuators are constructed whose plane of actuation is perpendicular to the plane of the array. This invention is useful for constructing N×M fiber optic switches, which direct light from N input fibers into M output fibers.

Abstract: A surface micromachined micromagnetic actuator is described, wherein rotary actuation is accomplished by a member pivotably mounted on the surface of the substrate. Angular motion of the member about the pivot point is imparted by the interaction of a magnetic tab affixed to the member, with flux generated in the gap of an electromagnetic core. Rotary motion is restricted to less than 360 degrees by using an integrally formed hinge between the pivoting member and the pivot point, rather than by a more complex bearing. By virtue of this design, a large range of motion can be achieved without requiring a true bearing to be fabricated in the device. The pivoting member is also constrained in either of two stable positions upon de-energization of the electromagnetic core, by the attachment of a bistable spring between the pivoting member and the substrate.

Abstract: The invention describes a method and apparatus for deploying micromachined actuators in a plane which is orthogonal to the original fabrication plane of the devices. Using batch-processing, photolithographic procedures known in the micromachined electro-mechanical system (MEMS) art, a plurality of devices is constructed on a suitable substrate. The devices are then separated one from another by sawing and dicing the original fabrication wafer. The devices are rotated into an orthogonal orientation and affixed to a second wafer. The second wafer also contains circuitry for addressing and manipulating each of the devices independently of the others. With this method and apparatus, arrays of actuators are constructed whose plane of actuation is perpendicular to the plane of the array. This invention is useful for constructing N×M fiber optic switches, which direct light from N input fibers into M output fibers.

Abstract: Pressurized fluid from a nozzle is applied against the movable member of a micromechanical device, in order to measure the mechanical properties of the device. The technique is non-destructive, non-invasive, can be applied at the wafer, row or die level, and at early or intermediate stages of fabrication.

Abstract: A surface micromachined micromagnetic actuator is described, wherein rotary actuation is accomplished by a member pivotably mounted on the surface of the substrate. Angular motion of the member about the pivot point is imparted by the interaction of a magnetic tab affixed to the member, with flux generated in the gap of an electromagnetic core. Rotary motion is restricted to less than 360 degrees by using an integrally formed hinge between the pivoting member and the pivot point, rather than by a more complex bearing. By virtue of this design, a large range of motion can be achieved without requiring a true bearing to be fabricated in the device. The pivoting member is also constrained in either of two stable positions upon de-energization of the electromagnetic core, by the attachment of a bistable spring between the pivoting member and the substrate.

Abstract: Pressurized fluid from a nozzle is applied against the movable member of a micromechanical device, in order to measure the mechanical properties of the device. The technique is non-destructive, non-invasive, can be applied at the wafer, row or die level, and at early or intermediate stages of fabrication.