Abstract: The present invention is operative to determine the angular pose of an assumed object. A series of projection sums are calculated from a sample image of the known object where the known object has an assumed pose. The projection sums are calculated for a range of angles and organized into a two dimensional array coined a projection image. An image of the known object is provided where the known object has an unknown pose. A projection sum is calculated across the image of the known object with the unknown pose preferably at the perpendicular. This projection sum is correlated against the projection image and the angle corresponding to the best correlation is determined to be the angular pose of the known object.

Abstract: The present invention provides for methods and an apparatus for evaluating objects having three dimensional features. One method involves using both two dimensional data sets to improve the processing of three dimensional data sets. The two dimensional data set can be used to pre-qualify the three dimensional data set, or may be used to locate that data within the three dimensional data set that is characteristic of the three dimensional feature. The invention may include a sensor configured to capture both three dimensional and two dimensional data. The present invention provides for an efficient technique to evaluate three dimensional data. The present invention also solves heretofore unrecognized problems associated with geometric distortion.

Abstract: The present invention captures images of a circuit chip with a time delay integration or TDI sensor. The circuit chip is on a movable stage which moves at the same rate at which the TDI sensor clocks. A pulsed laser is directed toward the circuit chip and activated in synchronisation with the clock rate of the TDI sensor such that laser is activated when the TDI sensor is imaging the object and the laser is deactivated when the TDI sensor is transferring its charge.

Abstract: The present invention captures images of a circuit chip with a time delay integration or TDI sensor. The circuit chip is on a movable stage which moves at the same rate at which the TDI sensor clocks. A pulsed laser is directed toward the circuit chip and activated in synchronisation with the clock rate of the TDI sensor such that laser is activated when the TDI sensor is imaging the object and the laser is deactivated when the TDI sensor is transferring its charge.

Abstract: A method and system are disclosed for automatically visually inspecting an article such as an electronic circuit wherein both reference and non-reference algorithms are utilized to detect circuit defects. The system includes a pipelined cellular image processor which is utilized to implement the non-reference algorithm and an arithmetic logic unit (ALU) is coupled to the output of the cellular image processor to perform the reference method. The non-reference method includes a spaces and traces algorithm and the reference method includes a topology matching algorithm. The system also includes an algorithm for locating and gauging critical areas of the circuit with sub-pixel accuracy.