Abstract: An integrated circuit may include a semiconductor die having a trench formed in a surface of the semiconductor die. One or more circuit components may be formed on the surface of the semiconductor die. The trench can extend into the semiconductor die next to at least one circuit component. The trench may surround the circuit component partially or wholly. The trench may be filled with a material having a lower bulk modulus than the semiconductor die in which the trench is formed.

Abstract: An integrated circuit may include a semiconductor die having a trench formed in a surface of the semiconductor die. One or more circuit components may be formed on the surface of the semiconductor die. The trench can extend into the semiconductor die next to at least one circuit component. The trench may surround the circuit component partially or wholly. The trench may be filled with a material having a lower bulk modulus than the semiconductor die in which the trench is formed.

Abstract: An integrated circuit may include a semiconductor die having a trench formed in a surface of the semiconductor die. One or more circuit components may be formed on the surface of the semiconductor die. The trench can extend into the semiconductor die next to at least one circuit component. The trench may surround the circuit component partially or wholly. The trench may be filled with a material having a lower bulk modulus than the semiconductor die in which the trench is formed.

Abstract: An integrated circuit may include a semiconductor die having a trench formed in a surface of the semiconductor die. One or more circuit components may be formed on the surface of the semiconductor die. The trench can extend into the semiconductor die next to at least one circuit component. The trench may surround the circuit component partially or wholly. The trench may be filled with a material having a lower bulk modulus than the semiconductor die in which the trench is formed.

Abstract: An infinite sample-and-hold circuit which employs a DAC and an ADC coupled with a mode control circuit. In acquisition mode, the mode control circuit connects the analog input signal to the ADC. The ADC drives the DAC and when the DAC output equals the analog input, the mode control circuit disconnects the analog input and the DAC drives the output in hold mode. The mode control circuit preferably includes a comparator/buffer circuit including switching circuitry. The ADC is preferably of the successive approximation type. The comparator/buffer is used in two modes: (1) open loop, as a comparator, and (2) closed loop, as a buffer. During acquisition, the comparator mode is used, while in hold mode the buffer mode is used. The utilization of the same amplifier to provide both functions allows cancellation of offset errors otherwise introduced by the comparator and buffer, at least to a first order.