Patents by Inventor Patrick F. Malone
Patrick F. Malone has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6660116Abstract: A capacitive filtered feedthrough assembly is formed in a solid state manner to employ highly miniaturized conductive paths each filtered by a discoid capacitive filter embedded in a capacitive filter array. A non-conductive, co-fired metal-ceramic substrate is formed from multiple layers that supports one or a plurality of substrate conductive paths and it is brazed to a conductive ferrule, adapted to be welded to a case, using a conductive, corrosion resistant braze material. The metal-ceramic substrate is attached to an internally disposed capacitive filter array that encloses one or a plurality of capacitive filter capacitor active electrodes each coupled to a filter array conductive path and at least one capacitor ground electrode. Each capacitive filter array conductive path is joined with a metal-ceramic conductive path to form a feedthrough conductive path.Type: GrantFiled: April 18, 2002Date of Patent: December 9, 2003Assignee: Medtronic, Inc.Inventors: William D. Wolf, James Strom, Craig L. Wiklund, Mary A. Fraley, Lynn M. Seifried, James E. Volmering, Patrick F. Malone, Samuel F. Haq
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Publication number: 20020166618Abstract: A capacitive filtered feedthrough assembly is formed in a solid state manner to employ highly miniaturized conductive paths each filtered by a discoid capacitive filter embedded in a capacitive filter array. A non-conductive, co-fired metal-ceramic substrate is formed from multiple layers that supports one or a plurality of substrate conductive paths and it is brazed to a conductive ferrule, adapted to be welded to a case, using a conductive, corrosion resistant braze material. The metal-ceramic substrate is attached to an internally disposed capacitive filter array that encloses one or a plurality of capacitive filter capacitor active electrodes each coupled to a filter array conductive path and at least one capacitor ground electrode. Each capacitive filter array conductive path is joined with a metal-ceramic conductive path to form a feedthrough conductive path.Type: ApplicationFiled: April 18, 2002Publication date: November 14, 2002Applicant: Medtronic, Inc.Inventors: William D. Wolf, James Strom, Craig L. Wiklund, Mary A. Fraley, Lynn M. Seifried, James E. Volmering, Patrick F. Malone, Samuel F. Haq
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Patent number: 6414835Abstract: A capacitive filtered feedthrough assembly is formed in a solid state manner to employ highly miniaturized conductive paths each filtered by a discoid capacitive filter embedded in a capacitive filter array. A non-conductive, co-fired metal-ceramic substrate is formed from multiple layers that supports one or a plurality of substrate conductive paths and it is brazed to a conductive ferrule, adapted to be welded to a case, using a conductive, corrosion resistant braze material. The metal-ceramic substrate is attached to an internally disposed capacitive filter array that encloses one or a plurality of capacitive filter capacitor active electrodes each coupled to a filter array conductive path and at least one capacitor ground electrode. Each capacitive filter array conductive path is joined with a metal-ceramic conductive path to form a feedthrough conductive path.Type: GrantFiled: March 1, 2000Date of Patent: July 2, 2002Assignee: Medtronic, Inc.Inventors: William D. Wolf, James Strom, Craig L. Wiklund, Mary A. Fraley, Lynn M. Seifried, James E. Volmering, Patrick F. Malone, Samuel F. Haq
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Patent number: 6284080Abstract: The present invention relates to multi-layer ceramic packaging of hybrid micro-electronic devices, including those for implantable medical devices. The invention permits size reduction and design simplification in such packaging by eliminating the need for electrolytic or electroless plating, and by eliminating or substantially eliminating the shrinkage variation typically associated with surface metallization techniques.Type: GrantFiled: July 26, 2000Date of Patent: September 4, 2001Assignee: Medtronic, Inc.Inventors: Samuel F. Haq, Patrick F. Malone, Donald P. Varner
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Patent number: 6216537Abstract: An accelerometer device which can be mounted on a substrate, e.g., a circuit board enclosed in a medical device, includes an accelerometer sensing element having an axis of sensitivity and further includes first and second multilayer end caps. The substrate generally defines a mounting plane. The accelerometer sensing element includes a device body having a longitudinal axis extending between generally parallel first and second ends thereof and further includes a principal surface extending between the first and second ends of the device body parallel to the longitudinal axis. The axis of sensitivity of the sensing element is generally perpendicular to a plane defined by the principal surface. Further, the accelerometer sensing element includes conductive pad regions on each of the first and second ends of the device body.Type: GrantFiled: March 31, 1999Date of Patent: April 17, 2001Assignee: Medtronic, Inc.Inventors: Mark E. Henschel, David Brian Hall, Scott B. Sleeper, Lary R. Larson, Brian S. Child, Patrick F. Malone, Samuel F. Haq, David A. Ruben, Joan A. O'Gara, James E. Volmering, Roy L. Inman
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Patent number: 6146743Abstract: The present invention relates to multi-layer ceramic packaging of hybrid micro-electronic devices, including those for implantable medical devices. The invention permits size reduction and design simplification in such packaging by eliminating the need for electrolytic or electroless plating, and by eliminating or substantially eliminating the shrinkage variation typically associated with surface metallization techniques.Type: GrantFiled: March 31, 1999Date of Patent: November 14, 2000Assignee: Medtronic, Inc.Inventors: Samuel F. Haq, Patrick F. Malone, Donald P. Varner
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Patent number: 6041496Abstract: The present invention relates to multi-layer ceramic packaging of hybrid micro-electronic devices, including those for implantable medical devices. The invention permits size reduction and design simplification in such packaging by eliminating the need for electrolytic or electroless plating, and by eliminating or substantially eliminating the shrinkage variation typically associated with surface metallization techniques.Type: GrantFiled: February 11, 1998Date of Patent: March 28, 2000Assignee: Medtronic, Inc.Inventors: Samuel F. Haq, Patrick F. Malone, John H. Fortney, Donald P. Varner
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Patent number: 5855995Abstract: The present invention relates to multi-layer ceramic packaging of hybrid micro-electronic devices, including those for implantable medical devices. The invention permits size reduction and design simplification in such packaging by eliminating the need for electrolytic or electroless plating, and by eliminating or substantially eliminating the shrinkage variation typically associated with surface metallization techniques.Type: GrantFiled: April 28, 1997Date of Patent: January 5, 1999Assignee: Medtronic, Inc.Inventors: Samuel F. Haq, Patrick F. Malone, John H. Fortney, Donald P. Varner
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Patent number: 5100859Abstract: The invention relates to catalyst carries for use in conjunction with silver, alkali metal promoters, rhenium promoters and optionally rhenium co-promoters selected from sulfur, molybdenum, tungsten, chromium and mixtures thereof. The carriers consisting of at least 85 and preferably 95 percent by weight of alpha alumina, from about 0.01 to about 6 percent by weight of an alkaline earth metal silicate and from about zero to about 10 percent by weight (measured as the dioxide of added zirconium in the form of an oxide.Type: GrantFiled: January 22, 1991Date of Patent: March 31, 1992Assignee: Norton CompanyInventors: William H. Gerdes, Carmine M. Doddato, Patrick F. Malone