Abstract: One embodiment is directed to a multi-rack rack controller for an automated infrastructure management (AIM) system comprising a plurality of independent patching equipment bus interfaces. Another embodiment is directed to a rack controller comprising at least one rack controller interface configured to connect the rack controller to another rack controller. Each rack controller interface comprises a respective termination circuit. The rack controller is configured to determine whether each rack controller interface is connected to another rack controller as a function of a respective sense signal developed by the termination circuit associated with said rack controller interface. Another embodiment is directed to a rack controller comprising a base unit having a locate button disposed on the front of the base unit. Other embodiments are disclosed.

Abstract: One embodiment is directed to a multi-rack rack controller for an automated infrastructure management (AIM) system comprising a plurality of independent patching equipment bus interfaces. Another embodiment is directed to a rack controller comprising at least one rack controller interface configured to connect the rack controller to another rack controller. Each rack controller interface comprises a respective termination circuit. The rack controller is configured to determine whether each rack controller interface is connected to another rack controller as a function of a respective sense signal developed by the termination circuit associated with said rack controller interface. Another embodiment is directed to a rack controller comprising a base unit having a locate button disposed on the front of the base unit. Other embodiments are disclosed.

Abstract: A kit for providing intelligence capability to a communications frame includes: a housing having a central portion, pairs of upper members extending from opposite sides of the central portion, and a plurality of fingers extending away from each of the upper members; a rear cover attached to the housing, the cover having a central body, pairs of upper legs extending from opposite sides of the central body, and a plurality of fingers extending away from each of the upper members; and a PCB having a central section, pairs of upper members extending from opposite sides of the central section, and a plurality of fingers extending away from each of the upper members, the PCB being adapted for attachment to the housing and rear cover, with the central section being sandwiched between the central portion and the central body, the PCB upper members being sandwiched between the rear cover upper members and the housing upper members, and the PCB fingers being sandwiched between the rear cover fingers and the housing fin

Abstract: A combination includes: (a) a communications module including: a housing; a printed wiring board mounted within the housing; a plurality of RJ-45 jacks mounted on the printed wiring board and accessible from one side of the housing; and a single module connector mounted to the printed wiring board and electrically connected to the RJ-45 jacks, connector being accessible from a second side of the housing; and (b) a cable-connector assembly including: a cable comprising a plurality of subunits, each of the subunits comprising a jacket and a plurality of twisted pairs of conductors positioned within the jacket; and a single cable connector mounted to the printed circuit board and electrically connected to the conductors of the cable subunits. The module connector is attached to the cable connector.

Abstract: A kit for providing intelligence capability to a communications frame includes: a housing having a central portion, pairs of upper members extending from opposite sides of the central portion, and a plurality of fingers extending away from each of the upper members; a rear cover attached to the housing, the cover having a central body, pairs of upper legs extending from opposite sides of the central body, and a plurality of fingers extending away from each of the upper members; and a PCB having a central section, pairs of upper members extending from opposite sides of the central section, and a plurality of fingers extending away from each of the upper members, the PCB being adapted for attachment to the housing and rear cover, with the central section being sandwiched between the central portion and the central body, the PCB upper members being sandwiched between the rear cover upper members and the housing upper members, and the PCB fingers being sandwiched between the rear cover fingers and the housing fin

Abstract: A method of retrofitting an existing patching system with an intelligent patching module includes the steps of: providing at least one patching shelf unit populated with interconnection sites, the shelf unit including a rear face and an opposing front side; routing a cable between a rear location located rearward of the rear face and the front side; connecting the cable to the intelligent patching module; and attaching the intelligent patching module to the shelf unit.

Abstract: A communications patching system includes a patch panel having a plurality of connector ports on a side thereof, and a sensor module secured to the patch panel side. The sensor module includes a plurality of pairs of IR emitters and sensors, with each emitter/sensor pair located adjacent to a respective one of the connector ports. Each emitter/sensor pair is configured to detect insertion and removal of a patch cord connector from a respective connector port. The sensor module includes a housing and a printed circuit board (PCB) secured to the housing. The IR emitters and sensors are electrically connected to the PCB, and the PCB includes a processor and memory for controlling the IR emitters and sensors.

Abstract: A communications patching system includes a patch panel having a plurality of connector ports on a side thereof, and a sensor module secured to the patch panel side. The sensor module includes a plurality of pairs of IR emitters and sensors, with each emitter/sensor pair located adjacent to a respective one of the connector ports. Each emitter/sensor pair is configured to detect insertion and removal of a patch cord connector from a respective connector port. The sensor module includes a housing and a printed circuit board (PCB) secured to the housing. The IR emitters and sensors are electrically connected to the PCB, and the PCB includes a processor and memory for controlling the IR emitters and sensors.

Abstract: A combination includes: (a) a communications module including: a housing; a printed wiring board mounted within the housing; a plurality of RJ-45 jacks mounted on the printed wiring board and accessible from one side of the housing; and a single module connector mounted to the printed wiring board and electrically connected to the RJ-45 jacks, connector being accessible from a second side of the housing; and (b) a cable-connector assembly including: a cable comprising a plurality of subunits, each of the subunits comprising a jacket and a plurality of twisted pairs of conductors positioned within the jacket; and a single cable connector mounted to the printed circuit board and electrically connected to the conductors of the cable subunits. The module connector is attached to the cable connector.

Abstract: A method of retrofitting an existing patching system with an intelligent patching module includes the steps of: providing at least one patching shelf unit populated with interconnection sites, the shelf unit including a rear face and an opposing front side; routing a cable between a rear location located rearward of the rear face and the front side; connecting the cable to the intelligent patching module; and attaching the intelligent patching module to the shelf unit.

Abstract: A communications patching system includes a patch panel having a plurality of connector ports on a side thereof, and a sensor module secured to the patch panel side. The sensor module includes a plurality of pairs of IR emitters and sensors, with each emitter/sensor pair located adjacent to a respective one of the connector ports. Each emitter/sensor pair is configured to detect insertion and removal of a patch cord connector from a respective connector port. The sensor module includes a housing and a printed circuit board (PCB) secured to the housing. The IR emitters and sensors are electrically connected to the PCB, and the PCB includes a processor and memory for controlling the IR emitters and sensors.

Abstract: An electronic device enclosure grounding structure (200) that provides a low impedance path to ground for selected AC frequencies. A conductive portion of an electronic enclosure, such as a conductive back (108) of a cell phone (100) has a capacitive coupling to a second surface (206) that is conductively isolated from the enclosure. Second surface (206) is connected to a ground point (207) through a conductive arm (205) that has a predefined inductance. The resulting series capacitance-inductance circuit (300) allows a reactive connection between the enclosure (108) and ground (207) that has a settable resonant frequency.