Patents by Inventor Patrick Fleischhacker

Patrick Fleischhacker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cooling profile integration for embedded power systems
    Patent number: 11523496
    Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A component is embedded in the stack. A first thermally conductive block is located above and thermally connected with the component, and a second thermally conductive block is located below and thermally coupled with the component. Heat generated by the component during operation is removed via at least one of the first thermally conductive block and the second thermally conductive block.
    Type: Grant
    Filed: February 19, 2021
    Date of Patent: December 6, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Rainer Frauwallner, Dietmar Drofenik, Patrick Fleischhacker
  • Component Carrier With Cavity Accommodating at Least Part of Driven Body Being Magnetically Drivable to Move
    Publication number: 20220254554
    Abstract: A drive device includes a component carrier with a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and a cavity formed in the stack. A driven body is arranged at least partially in the cavity and configured for being drivable to move relative to the component carrier. At least one drive coil for creating a magnetic drive field and at least one drive magnet interacts with the magnetic drive field created by the at least one drive coil to generate a force for moving the driven body relative to the component carrier. One of the at least one drive magnet and the at least one drive coil forms part of the component carrier and the other one of the at least one drive magnet and the at least one drive coil forms part of the driven body.
    Type: Application
    Filed: February 9, 2022
    Publication date: August 11, 2022
    Inventors: Gerald Weis, Gerald Weidinger, Sebastian Sattler, Patrick Fleischhacker
  • Cooling Profile Integration for Embedded Power Systems
    Publication number: 20210267044
    Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A component is embedded in the stack. A first thermally conductive block is located above and thermally connected with the component, and a second thermally conductive block is located below and thermally coupled with the component. Heat generated by the component during operation is removed via at least one of the first thermally conductive block and the second thermally conductive block.
    Type: Application
    Filed: February 19, 2021
    Publication date: August 26, 2021
    Inventors: Rainer Frauwallner, Dietmar Drofenik, Patrick Fleischhacker