Abstract: Disclosed are systems, methods, and devices for configuring the output provided by an inverter to an electric motor based on the position of the electric motor with respect to another electric motor.

Abstract: The present invention provides compounds and methods targeting human lymphotactins, including therapeutic antibodies, pharmaceutical compositions and methods of use thereof, useful in the field of immune-mediated diseases including ulcerative colitis, vitiligo, multiple sclerosis, alopecia areata, psoriasis, type 1 diabetes, and asthma.

Abstract: An electronic device includes a leadframe having a die pad and leads. A die that includes an active layer is attached to the die pad. A reinforcement layer is disposed on the active layer and wire bonds are attached from the active layer of the die to the leads. A mold compound encapsulates the die, the reinforcement layer, and the wire bonds.

Abstract: A method of encrypting data, in particular encrypting data in dependence on a user verification confidence level. An encryption algorithm is provided, data is input into the encryption algorithm, along with a public key and an access structure comprising the user verification confidence level. The encryption algorithm is run to output a cypher text of encrypted data, whereby the access structure is embedded into the cypher text such that only an entity satisfying the access structure can decrypt the cypher text.

Abstract: An integrated circuit (IC) package includes a molding having a first surface and a second surface, the first surface opposing the second surface. An interconnect is encased in the molding. The interconnect includes pads situated at a periphery of a side of the IC package. A portion of the pads are exposed at the first surface of the molding. A die pad is situated proximal to the second surface of the molding. The die pad has a first surface and a second surface, the first surface opposing the second surface, and the second surface is circumscribed by the second surface of the molding. A die is mounted on the first surface of the die pad. A heat spreader is mounted on the second surface of the molding and the second surface of the die pad. The heat spreader extends between edges of the second surface of the molding.

Abstract: In examples, a semiconductor device comprises a semiconductor package including a mold compound covering a semiconductor die. The semiconductor package has a surface and a cavity formed in the surface. The semiconductor device comprises an electronic device positioned within the cavity, the electronic device coupled to the semiconductor die via a conductive terminal extending through the mold compound.

Abstract: An integrated circuit (IC) die includes a substrate with circuitry configured for at least one function including metal interconnect levels thereon including a top metal interconnect level and a bottom metal interconnect level, with a passivation layer on the top metal interconnect level. A scribe street is around a periphery of the IC die, the scribe street including a scribe seal utilizing at least two of the plurality of metal interconnect levels, an inner metal meander stop ring including at least the top metal interconnect level located outside the scribe seal, wherein the scribe seal and the inner metal meander stop ring are separated by a first separation gap. An outer metal meander stop ring including at least the top metal interconnect level is located outside the inner metal stop ring, wherein the outer stop ring and the inner stop ring are separated by a second separation gap.

Abstract: An integrated circuit (IC) package includes a molding having a first surface and a second surface, the first surface opposing the second surface. An interconnect is encased in the molding. The interconnect includes pads situated at a periphery of a side of the IC package. A portion of the pads are exposed at the first surface of the molding. A die pad is situated proximal to the second surface of the molding. The die pad has a first surface and a second surface, the first surface opposing the second surface, and the second surface is circumscribed by the second surface of the molding. A die is mounted on the first surface of the die pad. A heat spreader is mounted on the second surface of the molding and the second surface of the die pad. The heat spreader extends between edges of the second surface of the molding.

Abstract: A system includes a computing device. The computing device includes a processor and a memory, the memory including instructions such that the processor is configured to: transform vehicle dynamics data to corresponding roadway geometry data, calculate a rationalization value based on a difference between the roadway geometry data and map-based roadway geometry data, and determine whether to modify a vehicle state based on the rationalization value.

Abstract: A method for manufacturing a package includes positioning a copper layer above a die. A zinc layer is positioned on the copper layer. The zinc and copper layers are then heated to produce a brass layer, the brass layer abutting the copper layer. Further, a polymer layer is positioned abutting the brass layer.

Abstract: An air treatment device includes a housing and a pad holder mounted within the housing. The pad holder has an opening providing access to a support surface for a scented pad. When positioned on the support surface the scented pad has a first end portion remote from the opening and a second end portion adjacent the opening. A mechanism associated with the pad holder is configured to at least partially remove the scented pad from the pad holder. The mechanism includes a lever arm and a pad pusher connected to the lever arm. The lever arm is configured such that movement of the lever arm pushes the pad pusher along the support surface toward the opening, the pad pusher engaging the first end portion of the scented pad and moving the second end portion of the scented pad at least partially out of the pad holder opening.

Abstract: A handle. The handle can include a body and a pivoting head pivotally coupled with the main body at a pivot axis. The pivoting head can include at least two mating parts defining an interior channel. A pivot spring can include a first coil spring and a second coil spring and a main bar portion that is at least partially disposed in the interior channel and interacts with the pivoting head to bias the pivoting head into a rest position. The main bar portion also can couple the first and second coil springs together in a spaced.

Abstract: In examples, a semiconductor device comprises a semiconductor package including a mold compound covering a semiconductor die. The semiconductor package has a surface and a cavity formed in the surface. The semiconductor device comprises an electronic device positioned within the cavity, the electronic device coupled to the semiconductor die via a conductive terminal extending through the mold compound.

Abstract: In examples, a chip scale package (CSP) comprises a semiconductor die; a conductive terminal coupled to the semiconductor die; and a non-conductive coat covering a backside of the semiconductor die and a sidewall of the semiconductor die. The non-conductive coat has a thickness of less than 45 microns.

Abstract: Methods, systems, and apparatuses, including computer programs encoded on computer-readable media, for receiving a first communication request, from a web browser of a user. A request for information is sent to the web browser. A first communication as part of the first conversation is received from the user. A conversation identifier is identified and used to store the conversation of the first user. A request is received from a second, different, responder for the conversation. The conversation identifier is determined based on the request from the second responder. The request for information and first communication are retrieved from a persistent data store and sent to the second responder.

Abstract: In some examples a wafer chip scale package (WCSP) includes a semiconductor die having a device side in which a circuit is formed, and a redistribution layer (RDL) coupled to the device side that is positioned within an insulating member. In addition, the WCSP includes a scribe seal circumscribing the circuit along the device side, wherein the RDL abuts the scribe seal. Further, the WCSP includes a conductive member coupled to the RDL. The conductive member is configured to receive a solder member, and the insulating member does not extend along the device side of the semiconductor die between the conductive member and a portion of an outer perimeter of the WCSP closest to the conductive member.

Abstract: Methods, systems, and apparatuses, including computer programs encoded on computer-readable media, for receiving a first communication request, from a web browser of a user. A first responder requests information and a response to the request for information is received as part of a conversation. A conversation identifier is used to store the conversation. Based on the conversation, the conversation is determined to stop and a second responder is identified. The conversation is then transferred to the second responder.

Abstract: In examples, a chip scale package (CSP) comprises a semiconductor die; a conductive terminal coupled to the semiconductor die; and a non-conductive coat covering a backside of the semiconductor die and a sidewall of the semiconductor die. The non-conductive coat has a thickness of less than 45 microns.