Abstract: A method for manufacturing a package includes positioning a copper layer above a die. A zinc layer is positioned on the copper layer. The zinc and copper layers are then heated to produce a brass layer, the brass layer abutting the copper layer. Further, a polymer layer is positioned abutting the brass layer.

Abstract: Provided herein are methods, compositions, and kits for preparing biological samples for multiplex spatial gene expression and proteomic analysis, such as determining a location of a nucleic acid analyte and a protein analyte in a biological sample.

Abstract: An air treatment device includes a housing and a pad holder mounted within the housing. The pad holder has an opening providing access to a support surface for a scented pad. When positioned on the support surface the scented pad has a first end portion remote from the opening and a second end portion adjacent the opening. A mechanism associated with the pad holder is configured to at least partially remove the scented pad from the pad holder. The mechanism includes a lever arm and a pad pusher connected to the lever arm. The lever arm is configured such that movement of the lever arm pushes the pad pusher along the support surface toward the opening, the pad pusher engaging the first end portion of the scented pad and moving the second end portion of the scented pad at least partially out of the pad holder opening.

Abstract: An electrical conductor assembly for use in a power distribution assembly includes an electrical conductor and a casing covering at least a portion of the electrical conductor. A spring member is mounted to the casing and configured to apply a compressive force to the electrical conductor.

Abstract: A handle. The handle can include a body and a pivoting head pivotally coupled with the main body at a pivot axis. The pivoting head can include at least two mating parts defining an interior channel. A pivot spring can include a first coil spring and a second coil spring and a main bar portion that is at least partially disposed in the interior channel and interacts with the pivoting head to bias the pivoting head into a rest position. The main bar portion also can couple the first and second coil springs together in a spaced.

Abstract: In examples, a semiconductor device comprises a semiconductor package including a mold compound covering a semiconductor die. The semiconductor package has a surface and a cavity formed in the surface. The semiconductor device comprises an electronic device positioned within the cavity, the electronic device coupled to the semiconductor die via a conductive terminal extending through the mold compound.

Abstract: A method, computer program product, and computing system for identifying a target output token associated with an output of a machine learning model. A portion of training data corresponding to the target output token is modified with a watermark feature, thus defining watermarked training data.

Abstract: A method, computer program product, and computing system for determining a plurality of transfer functions for a plurality of corresponding segments from a reference recording and a suspect recording. A delta transfer function between the plurality of transfer functions of a pair of corresponding segments of the plurality of corresponding segments is determined. A recording comparison confidence score is generated for the pair of corresponding segments based upon, at least in part, the delta transfer function. The suspect recording is verified based upon, at least in part, the plurality of recording comparison confidence scores.

Abstract: A method, computer program product, and computing system for receiving, from a requesting party, a request to access data from a storage device. Identity information associated with the requesting party is determined. A bespoke identity-based watermark is generated for the requesting party. The bespoke identity-based watermark is encoded into the data. The watermarked data is provided to the requesting party.

Abstract: A method, computer program product, and computing system for processing audio information associated with a speech processing system and encoding a watermark in a non-disruptive portion of the audio information.

Abstract: In examples, a chip scale package (CSP) comprises a semiconductor die; a conductive terminal coupled to the semiconductor die; and a non-conductive coat covering a backside of the semiconductor die and a sidewall of the semiconductor die. The non-conductive coat has a thickness of less than 45 microns.

Abstract: Methods, systems, and apparatuses, including computer programs encoded on computer-readable media, for receiving a first communication request, from a web browser of a user. A first responder requests information and a response to the request for information is received as part of a conversation. A conversation identifier is used to store the conversation. Based on the conversation, the conversation is determined to stop and a second responder is identified. The conversation is then transferred to the second responder.

Abstract: Methods, systems, and apparatuses, including computer programs encoded on computer-readable media, for receiving a first communication request, from a web browser of a user. A request for information is sent to the web browser. A first communication as part of the first conversation is received from the user. A conversation identifier is identified and used to store the conversation of the first user. A request is received from a second, different, responder for the conversation. The conversation identifier is determined based on the request from the second responder. The request for information and first communication are retrieved from a persistent data store and sent to the second responder.

Abstract: In some examples a wafer chip scale package (WCSP) includes a semiconductor die having a device side in which a circuit is formed, and a redistribution layer (RDL) coupled to the device side that is positioned within an insulating member. In addition, the WCSP includes a scribe seal circumscribing the circuit along the device side, wherein the RDL abuts the scribe seal. Further, the WCSP includes a conductive member coupled to the RDL. The conductive member is configured to receive a solder member, and the insulating member does not extend along the device side of the semiconductor die between the conductive member and a portion of an outer perimeter of the WCSP closest to the conductive member.

Abstract: In examples, a chip scale package (CSP) comprises a semiconductor die; a conductive terminal coupled to the semiconductor die; and a non-conductive coat covering a backside of the semiconductor die and a sidewall of the semiconductor die. The non-conductive coat has a thickness of less than 45 microns.

Abstract: Methods, systems, and apparatuses, including computer programs encoded on computer-readable media, for receiving a first communication request, from a web browser of a user. A first responder requests information and a response to the request for information is received as part of a conversation. A conversation identifier is used to store the conversation. Based on the conversation, the conversation is determined to stop and a second responder is identified. The conversation is then transferred to the second responder.

Abstract: A computer-implemented method for enabling shared media interactions may include (i) identifying a group message thread that is composed of messages between a group of users, (ii) detecting that a user in the group of users is interacting with a media item posted in the group message thread, (iii) in response to detecting that the user is interacting with the media item, initiating a shared media interaction session in the group message thread for the media item, and (iv) notifying the group of users that the shared media interaction session is available in the group message thread. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: A described example includes: a reconstituted semiconductor device flip chip mounted on a device side surface of a package substrate, the package substrate having terminals for connecting the package substrate to a circuit board, the reconstituted semiconductor device further including: a semiconductor die mounted in a dielectric layer and having bond pads spaced from one another by at least a first pitch distance that is less than 100 microns; a redistribution layer formed over the bond pads having conductors in passivation layers; solder bumps on the redistribution layer coupled to the bond pads of the semiconductor die, the solder bumps spaced from one another by at least a second pitch distance that is greater than the first pitch distance; and solder joints formed between the package substrate and the solder bumps, the solder joints coupling the package substrate to the semiconductor die in the reconstituted semiconductor device.

Abstract: A system and method for secure cloud computing. The cloud based processing system comprises a user interface, allowing a user to enter and edit data, a proxy server, and a cloud based processing server. The user interface sends data entered by a user to the proxy server, which sends the encrypted data to the cloud based processing server. The proxy server receives editing commands from the user interface, and sends those commands to the cloud based processing server along with the encrypted data. The cloud based processing server receives the encrypted data and editing commands, applies the editing commands to the encrypted data, and sends the edited encrypted data back to the proxy server.

Abstract: An integrated circuit (IC) package includes a molding having a first surface and a second surface, the first surface opposing the second surface. An interconnect is encased in the molding. The interconnect includes pads situated at a periphery of a side of the IC package. A portion of the pads are exposed at the first surface of the molding. A die pad is situated proximal to the second surface of the molding. The die pad has a first surface and a second surface, the first surface opposing the second surface, and the second surface is circumscribed by the second surface of the molding. A die is mounted on the first surface of the die pad. A heat spreader is mounted on the second surface of the molding and the second surface of the die pad. The heat spreader extends between edges of the second surface of the molding.