Abstract: The invention relates to a reactive single-component adhesive composition which is liquid at room temperature and which has 3 wt. % to 90 wt. % of at least one alpha-silane-terminated organic polymer, 0 wt. % to 80 wt. % of at least one silicone resin, 0.1 wt. % to 5 wt. % of at least one thermal accelerator, 0.001 wt. % to 5 wt. % of at least one low-molecular silane which has a primary or secondary amino group or a blocked amino group that is hydrogenated in order to form the primary or secondary amino group, and 0 wt. % to 85 wt. % of at least one filler. The invention additionally relates to a method for adhering two substrates using the aforementioned adhesive composition and to a system adhered in such a manner.

Abstract: The present invention relates to reactive hotmelt adhesive compositions comprising, based on the total weight of the composition, a) 3 wt % to 49 wt % of at least one alpha-silane-terminated organic polymer; b) 1 wt % to less than 20 wt %, preferably 1 wt % to 10 wt %, of at least one acrylate resin-based polymer; c) 1 wt % to 20 wt %, preferably 1 wt % to 10 wt %, of at least one chemical compound which is liquid at least at 100° C. and in which at least at 150° C. the at least one acrylate resin-based polymer dissolves; d) 0.001 wt % to 5 wt %, preferably 0.001 wt % to 2 wt %, of at least one oligomeric silane comprising one or more amino groups. The invention additionally relates to processes for producing them and to a process for surface lamination using the composition.

Abstract: The invention relates to a reactive single-component adhesive composition which is liquid at room temperature and which has 3 wt. % to 90 wt. % of at least one alpha-silane-terminated organic polymer, 0 wt. % to 80 wt. % of at least one silicone resin, 0.1 wt. % to 5 wt. % of at least one thermal accelerator, 0.001 wt. % to 5 wt. % of at least one low-molecular silane which has a primary or secondary amino group or a blocked amino group that is hydrogenated in order to form the primary or secondary amino group, and 0 wt. % to 85 wt. % of at least one filler. The invention additionally relates to a method for adhering two substrates using the aforementioned adhesive composition and to a system adhered in such a manner.

Abstract: The present invention relates to reactive hotmelt adhesive compositions comprising, based on the total weight of the composition, a) 3 wt % to 49 wt % of at least one alpha-silane-terminated organic polymer; b) 1 wt % to less than 20 wt %, preferably 1 wt % to 10 wt %, of at least one acrylate resin-based polymer; c) 1 wt % to 20 wt %, preferably 1 wt % to 10 wt %, of at least one chemical compound which is liquid at least at 100° C. and in which at least at 150° C. the at least one acrylate resin-based polymer dissolves; d) 0.001 wt % to 5 wt %, preferably 0.001 wt % to 1 wt %, of at least one low molecular mass silane which comprises a primary or secondary amino group or a blocked amino group which hydrolyses to the primary or secondary amino group. The invention additionally relates to processes for producing them and to a process for surface lamination using the composition.