Abstract: Adhesive compositions comprising an aqueous dispersion of an acrylic polymer are disclosed, with such compositions having particular applicability in additive manufacturing processes, such as three-dimensional (3D) printing, including Fused Filament Fabrication (FFF). In particular, the compositions address drawbacks associated with an improper degree of adhesion between a thermoplastic build material and build plate, which decrease the quality of printed objects. In representative aqueous dispersions, the solids content of at least about 5 wt. % and also most about 95 wt. % of the acrylic polymer is solubilized, with the balance of this polymer comprising dispersed solid particles.

Abstract: In one embodiment, a filament can comprise a thermoplastic polyimide, wherein the filament is adapted for use in a fused filament fabrication process and the thermoplastic polyimide may have a glass transition temperature not greater than 215° C. Three-dimensional bodies can be printed with the filament, wherein the three-dimensional bodies can have high strength values with even mechanical properties in printing direction and orthogonal to the printing direction.

Abstract: In one embodiment, a powder composition can comprise polyimide particles, wherein the polyimide particles can have a glass transition temperature of not greater than 200° C. and a crystallinity of not greater than 20%. The powder composition can be adapted for forming a three-dimensional polyimide-based body in a powder-based additive manufacturing process. In one aspect, the polyimide particles can have an average particle size (D50) of at least 20 microns and not greater than 120 microns, an amount of the polyimide particles can be at least 60 wt % based on the total weight of the powder composition; and a material of the polyimide particles is a polymerization product of at least one diamine monomer and at least one dianhydride monomer.

Abstract: The invention relates to a method for forming a three-dimensional object by fused filament fabrication comprising the step of selectively dispensing a polymer composition containing a semi-crystalline copolyamide in accordance with the shape of a portion of a three-dimensional object, characterized that the semi-crystalline copolyamide comprises: a) At least 70 wt. % of aliphatic monomeric units derived from i. Aminoacid A, or ii. diamine B and diacid C, and b) At least 0.5 wt. % of further monomeric units derived from a cyclic monomer, wherein wt. % is with respect to the total weight of the semi-crystalline copolyamide. The invention relates also relates to objects attainable by this method and to the use of the said semi-crystalline copolyamide in fused filament fabrication.

Abstract: Apparatuses and methods for producing three-dimensional objects are disclosed. In an embodiment, an apparatus for solid freeform fabrication comprises a movable nozzle comprising a nozzle opening, a heating element connected to the movable nozzle, a driver connected to the movable nozzle, a platform for receiving a build material from the movable nozzle, and a hopper for providing the build material to the driver, the hopper comprising a hopper opening, wherein the nozzle opening and the hopper opening are capable of simultaneous alignment on a straight axis such that the build material, when present, is capable of traveling along the straight axis at least from the hopper opening until the build material attains a flowable state.

Abstract: Adhesive compositions comprising an aqueous dispersion of an acrylic polymer are disclosed, with such compositions having particular applicability in additive manufacturing processes, such as three-dimensional (3D) printing, including Fused Filament Fabrication (FFF). In particular, the compositions address drawbacks associated with an improper degree of adhesion between a thermoplastic build material and build plate, which decrease the quality of printed objects. In representative aqueous dispersions, the solids content of at least about 5 wt. % and also most about 95 wt. % of the acrylic polymer is solubilized, with the balance of this polymer comprising dispersed solid particles.

Abstract: The invention relates to a method for forming a three-dimensional object by fused filament fabrication comprising the step of selectively dispensing a polymer composition containing a semi-crystalline copolyamide in accordance with the shape of a portion of a three-dimensional object, characterized that the semi-crystalline copolyamide comprises: a) At least 70 wt. % of aliphatic monomeric units derived from i. Aminoacid A, or ii. diamine B and diacid C, and b) At least 0.5 wt. % of further monomeric units derived from a cyclic monomer, wherein wt. % is with respect to the total weight of the semi-crystalline copolyamide. The invention relates also relates to objects attainable by this method and to the use of the said semi-crystalline copolyamide in fused filament fabrication.

Abstract: Apparatuses and methods for producing three-dimensional objects are disclosed. In an embodiment, an apparatus for solid freeform fabrication comprises a movable nozzle comprising a nozzle opening, a heating element connected to the movable nozzle, a driver connected to the movable nozzle, a platform for receiving a build material from the movable nozzle, and a hopper for providing the build material to the driver, the hopper comprising a hopper opening, wherein the nozzle opening and the hopper opening are capable of simultaneous alignment on a straight axis such that the build material, when present, is capable of traveling along the straight axis at least from the hopper opening until the build material attains a flowable state.

Abstract: The invention relates to a smart junction box made from a thermally conductive thermoplastic polymer composition comprising a thermoplastic polymer, between 10 and 40 wt. % of a thermally conductive (TC) filler, between 15 and 30 wt. % of a flame retardant (FR) and between 20 and 45 wt. % of glass fibres (GF). The invention also relates to a polymer composition comprising between 25 and 67.5 wt. % of at least one aliphatic polyamide, between 10 and 40 wt. % of a thermally conductive (TC) filler, between 15 and 30 wt. % of a flame retardant (FR) and between 7.5 and 40 wt. % of glass fibres (GF), wherein the weight percentages (wt. %) are relative to the total weight of the composition.

Abstract: The invention relates to a polyamide composition with an increased resistance against blistering that is for example the result of a reflow soldering process. The composition comprises: A) 99-50 wt % of at least one polyamide A derived from: A1) at least one di-amine monomer having 4 carbon atoms and wherein the amount of C4-diamine is at least 2 mol % relative to the total amount of di-amine and, A2) at least one di-acid monomer, wherein at least one of the monomers has at least one aromatic structural unit, and wherein the polyamide A, has a molecular weight, expressed as Mn, of at least 9000 g/mol, and B) 1-50 wt % of at least one reinforcing agent and C) 0-20 wt % of inorganic fillers and/or additives, D) 0-49 wt % of one or more polymers other than A) wherein the sum of A, B, C and D amounts to 100 wt %. The invention also relates to the use of the polyamide composition and to a shaped article made out of the polyamide composition.